EMBEDDED AND DISTRIBUTED INDUCTIVE DEVICES
An electronic package comprises an integrated circuit (IC) configured to receive a power input signal and to deliver a regulated power output signal. A multilayer electrical routing structure is attached to the IC and is configured to couple the electronic package to an external circuit. The multila...
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creator | Antunes Bezerra, Alexandre Der Minassians, Artin |
description | An electronic package comprises an integrated circuit (IC) configured to receive a power input signal and to deliver a regulated power output signal. A multilayer electrical routing structure is attached to the IC and is configured to couple the electronic package to an external circuit. The multilayer routing structure has one or more electrical conductors on each of at least two layers which are configured to route the power input signal from the external circuit to the IC and to route the regulated power output signal from the IC to the external circuit. The one or more electrical conductors form an integrated inductive device having a respective portion disposed on each of the at least two layers and the power output signal is coupled to the external circuit through the integrated inductive device. |
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fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_US2022059276A1</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>US2022059276A1</sourcerecordid><originalsourceid>FETCH-epo_espacenet_US2022059276A13</originalsourceid><addsrcrecordid>eNrjZNBy9XVydXFxdVFw9HNRcPEMDgnydAoNAfI9_VxCnUM8w1wVXFzDPJ1dg3kYWNMSc4pTeaE0N4Oym2uIs4duakF-fGpxQWJyal5qSXxosJGBkZGBqaWRuZmjoTFxqgDRqyV5</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>EMBEDDED AND DISTRIBUTED INDUCTIVE DEVICES</title><source>esp@cenet</source><creator>Antunes Bezerra, Alexandre ; Der Minassians, Artin</creator><creatorcontrib>Antunes Bezerra, Alexandre ; Der Minassians, Artin</creatorcontrib><description>An electronic package comprises an integrated circuit (IC) configured to receive a power input signal and to deliver a regulated power output signal. A multilayer electrical routing structure is attached to the IC and is configured to couple the electronic package to an external circuit. The multilayer routing structure has one or more electrical conductors on each of at least two layers which are configured to route the power input signal from the external circuit to the IC and to route the regulated power output signal from the IC to the external circuit. The one or more electrical conductors form an integrated inductive device having a respective portion disposed on each of the at least two layers and the power output signal is coupled to the external circuit through the integrated inductive device.</description><language>eng</language><subject>BASIC ELECTRIC ELEMENTS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; INDUCTANCES ; MAGNETS ; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES ; SEMICONDUCTOR DEVICES ; TRANSFORMERS</subject><creationdate>2022</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20220224&DB=EPODOC&CC=US&NR=2022059276A1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20220224&DB=EPODOC&CC=US&NR=2022059276A1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>Antunes Bezerra, Alexandre</creatorcontrib><creatorcontrib>Der Minassians, Artin</creatorcontrib><title>EMBEDDED AND DISTRIBUTED INDUCTIVE DEVICES</title><description>An electronic package comprises an integrated circuit (IC) configured to receive a power input signal and to deliver a regulated power output signal. A multilayer electrical routing structure is attached to the IC and is configured to couple the electronic package to an external circuit. The multilayer routing structure has one or more electrical conductors on each of at least two layers which are configured to route the power input signal from the external circuit to the IC and to route the regulated power output signal from the IC to the external circuit. The one or more electrical conductors form an integrated inductive device having a respective portion disposed on each of the at least two layers and the power output signal is coupled to the external circuit through the integrated inductive device.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>INDUCTANCES</subject><subject>MAGNETS</subject><subject>SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES</subject><subject>SEMICONDUCTOR DEVICES</subject><subject>TRANSFORMERS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2022</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZNBy9XVydXFxdVFw9HNRcPEMDgnydAoNAfI9_VxCnUM8w1wVXFzDPJ1dg3kYWNMSc4pTeaE0N4Oym2uIs4duakF-fGpxQWJyal5qSXxosJGBkZGBqaWRuZmjoTFxqgDRqyV5</recordid><startdate>20220224</startdate><enddate>20220224</enddate><creator>Antunes Bezerra, Alexandre</creator><creator>Der Minassians, Artin</creator><scope>EVB</scope></search><sort><creationdate>20220224</creationdate><title>EMBEDDED AND DISTRIBUTED INDUCTIVE DEVICES</title><author>Antunes Bezerra, Alexandre ; Der Minassians, Artin</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_US2022059276A13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2022</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>INDUCTANCES</topic><topic>MAGNETS</topic><topic>SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES</topic><topic>SEMICONDUCTOR DEVICES</topic><topic>TRANSFORMERS</topic><toplevel>online_resources</toplevel><creatorcontrib>Antunes Bezerra, Alexandre</creatorcontrib><creatorcontrib>Der Minassians, Artin</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>Antunes Bezerra, Alexandre</au><au>Der Minassians, Artin</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>EMBEDDED AND DISTRIBUTED INDUCTIVE DEVICES</title><date>2022-02-24</date><risdate>2022</risdate><abstract>An electronic package comprises an integrated circuit (IC) configured to receive a power input signal and to deliver a regulated power output signal. A multilayer electrical routing structure is attached to the IC and is configured to couple the electronic package to an external circuit. The multilayer routing structure has one or more electrical conductors on each of at least two layers which are configured to route the power input signal from the external circuit to the IC and to route the regulated power output signal from the IC to the external circuit. The one or more electrical conductors form an integrated inductive device having a respective portion disposed on each of the at least two layers and the power output signal is coupled to the external circuit through the integrated inductive device.</abstract><oa>free_for_read</oa></addata></record> |
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subjects | BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY INDUCTANCES MAGNETS SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES SEMICONDUCTOR DEVICES TRANSFORMERS |
title | EMBEDDED AND DISTRIBUTED INDUCTIVE DEVICES |
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