SEMICONDUCTOR CHIP MODULE
A semiconductor chip module includes a PCB including first and second faces; a buffer on the first face; a first chip on the first face, and including a first connection terminal and a second connection terminal, a first signal being provided to the first connection terminal, and a second signal bei...
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creator | LEE, Gyu Chae CHO, Jeong Hyeon SEOK, Jong-Hyun |
description | A semiconductor chip module includes a PCB including first and second faces; a buffer on the first face; a first chip on the first face, and including a first connection terminal and a second connection terminal, a first signal being provided to the first connection terminal, and a second signal being provided to the second connection terminal; a second chip on the second face, and including a third connection terminal to which the first signal is provided, and a fourth connection terminal to which the second signal is provided. The first connection terminal and the third connection terminal may receive the first signal from the buffer at the same time. The first connection terminal may be closer to the buffer as compared with the second connection terminal. The third connection terminal may be closer to the buffer as compared with the fourth connection terminal. |
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The first connection terminal and the third connection terminal may receive the first signal from the buffer at the same time. The first connection terminal may be closer to the buffer as compared with the second connection terminal. 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The first connection terminal and the third connection terminal may receive the first signal from the buffer at the same time. The first connection terminal may be closer to the buffer as compared with the second connection terminal. The third connection terminal may be closer to the buffer as compared with the fourth connection terminal.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>PRINTED CIRCUITS</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2022</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZJAMdvX1dPb3cwl1DvEPUnD28AxQ8PV3CfVx5WFgTUvMKU7lhdLcDMpuriHOHrqpBfnxqcUFicmpeakl8aHBRgZGRgYmZuaW5o6GxsSpAgCdXCEL</recordid><startdate>20220210</startdate><enddate>20220210</enddate><creator>LEE, Gyu Chae</creator><creator>CHO, Jeong Hyeon</creator><creator>SEOK, Jong-Hyun</creator><scope>EVB</scope></search><sort><creationdate>20220210</creationdate><title>SEMICONDUCTOR CHIP MODULE</title><author>LEE, Gyu Chae ; CHO, Jeong Hyeon ; SEOK, Jong-Hyun</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_US2022046797A13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2022</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>PRINTED CIRCUITS</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>LEE, Gyu Chae</creatorcontrib><creatorcontrib>CHO, Jeong Hyeon</creatorcontrib><creatorcontrib>SEOK, Jong-Hyun</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>LEE, Gyu Chae</au><au>CHO, Jeong Hyeon</au><au>SEOK, Jong-Hyun</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>SEMICONDUCTOR CHIP MODULE</title><date>2022-02-10</date><risdate>2022</risdate><abstract>A semiconductor chip module includes a PCB including first and second faces; a buffer on the first face; a first chip on the first face, and including a first connection terminal and a second connection terminal, a first signal being provided to the first connection terminal, and a second signal being provided to the second connection terminal; a second chip on the second face, and including a third connection terminal to which the first signal is provided, and a fourth connection terminal to which the second signal is provided. The first connection terminal and the third connection terminal may receive the first signal from the buffer at the same time. The first connection terminal may be closer to the buffer as compared with the second connection terminal. The third connection terminal may be closer to the buffer as compared with the fourth connection terminal.</abstract><oa>free_for_read</oa></addata></record> |
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subjects | BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES |
title | SEMICONDUCTOR CHIP MODULE |
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