PHOTO-ETCHED CHASSIS COOLING WALLS

An electronic component enclosure includes a plurality of wall structures defining outer walls of the enclosure. Each wall structure has an internal fluid channel for circulation of cooling fluid. The enclosure further includes at least one partition structure disposed within the outer walls and hav...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: Lunsman, Harvey, Franz, John
Format: Patent
Sprache:eng
Schlagworte:
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