PLASMA PROCESSING ASSEMBLY USING PULSED-VOLTAGE AND RADIO-FREQUENCY POWER

Embodiments of the disclosure provided herein include an apparatus and method for the plasma processing of a substrate in a processing chamber. More specifically, embodiments of this disclosure describe a biasing scheme that is configured to provide a radio frequency (RF) generated RF waveform from...

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Hauptverfasser: LUERE, Olivier, DHINDSA, Rajinder, ROGERS, James, RAMASWAMY, Kartik, BYUN, Daniel Sang, DORF, Leonid, GUO, Yue, TODOROW, Valentin N, KAMENETSKIY, Evgeny, Cui, Linying
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creator LUERE, Olivier
DHINDSA, Rajinder
ROGERS, James
RAMASWAMY, Kartik
BYUN, Daniel Sang
DORF, Leonid
GUO, Yue
TODOROW, Valentin N
KAMENETSKIY, Evgeny
Cui, Linying
description Embodiments of the disclosure provided herein include an apparatus and method for the plasma processing of a substrate in a processing chamber. More specifically, embodiments of this disclosure describe a biasing scheme that is configured to provide a radio frequency (RF) generated RF waveform from an RF generator to one or more electrodes within a processing chamber and a pulsed-voltage (PV) waveform delivered from one or more pulsed-voltage (PV) generators to the one or more electrodes within the processing chamber. The plasma process(es) disclosed herein can be used to control the shape of an ion energy distribution function (IEDF) and the interaction of the plasma with a surface of a substrate during plasma processing.
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fullrecord <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_US2022037119A1</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>US2022037119A1</sourcerecordid><originalsourceid>FETCH-epo_espacenet_US2022037119A13</originalsourceid><addsrcrecordid>eNrjZPAM8HEM9nVUCAjyd3YNDvb0c1dwDA529XXyiVQIBXMDQn2CXV10w_x9QhzdXRUc_VwUghxdPP113YJcA0Nd_ZwjFQL8w12DeBhY0xJzilN5oTQ3g7Kba4izh25qQX58anFBYnJqXmpJfGiwkYGRkYGxuaGhpaOhMXGqAA_pLlU</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>PLASMA PROCESSING ASSEMBLY USING PULSED-VOLTAGE AND RADIO-FREQUENCY POWER</title><source>esp@cenet</source><creator>LUERE, Olivier ; DHINDSA, Rajinder ; ROGERS, James ; RAMASWAMY, Kartik ; BYUN, Daniel Sang ; DORF, Leonid ; GUO, Yue ; TODOROW, Valentin N ; KAMENETSKIY, Evgeny ; Cui, Linying</creator><creatorcontrib>LUERE, Olivier ; DHINDSA, Rajinder ; ROGERS, James ; RAMASWAMY, Kartik ; BYUN, Daniel Sang ; DORF, Leonid ; GUO, Yue ; TODOROW, Valentin N ; KAMENETSKIY, Evgeny ; Cui, Linying</creatorcontrib><description>Embodiments of the disclosure provided herein include an apparatus and method for the plasma processing of a substrate in a processing chamber. More specifically, embodiments of this disclosure describe a biasing scheme that is configured to provide a radio frequency (RF) generated RF waveform from an RF generator to one or more electrodes within a processing chamber and a pulsed-voltage (PV) waveform delivered from one or more pulsed-voltage (PV) generators to the one or more electrodes within the processing chamber. The plasma process(es) disclosed herein can be used to control the shape of an ion energy distribution function (IEDF) and the interaction of the plasma with a surface of a substrate during plasma processing.</description><language>eng</language><subject>BASIC ELECTRIC ELEMENTS ; ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS ; ELECTRICITY</subject><creationdate>2022</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20220203&amp;DB=EPODOC&amp;CC=US&amp;NR=2022037119A1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25543,76294</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20220203&amp;DB=EPODOC&amp;CC=US&amp;NR=2022037119A1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>LUERE, Olivier</creatorcontrib><creatorcontrib>DHINDSA, Rajinder</creatorcontrib><creatorcontrib>ROGERS, James</creatorcontrib><creatorcontrib>RAMASWAMY, Kartik</creatorcontrib><creatorcontrib>BYUN, Daniel Sang</creatorcontrib><creatorcontrib>DORF, Leonid</creatorcontrib><creatorcontrib>GUO, Yue</creatorcontrib><creatorcontrib>TODOROW, Valentin N</creatorcontrib><creatorcontrib>KAMENETSKIY, Evgeny</creatorcontrib><creatorcontrib>Cui, Linying</creatorcontrib><title>PLASMA PROCESSING ASSEMBLY USING PULSED-VOLTAGE AND RADIO-FREQUENCY POWER</title><description>Embodiments of the disclosure provided herein include an apparatus and method for the plasma processing of a substrate in a processing chamber. More specifically, embodiments of this disclosure describe a biasing scheme that is configured to provide a radio frequency (RF) generated RF waveform from an RF generator to one or more electrodes within a processing chamber and a pulsed-voltage (PV) waveform delivered from one or more pulsed-voltage (PV) generators to the one or more electrodes within the processing chamber. The plasma process(es) disclosed herein can be used to control the shape of an ion energy distribution function (IEDF) and the interaction of the plasma with a surface of a substrate during plasma processing.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS</subject><subject>ELECTRICITY</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2022</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZPAM8HEM9nVUCAjyd3YNDvb0c1dwDA529XXyiVQIBXMDQn2CXV10w_x9QhzdXRUc_VwUghxdPP113YJcA0Nd_ZwjFQL8w12DeBhY0xJzilN5oTQ3g7Kba4izh25qQX58anFBYnJqXmpJfGiwkYGRkYGxuaGhpaOhMXGqAA_pLlU</recordid><startdate>20220203</startdate><enddate>20220203</enddate><creator>LUERE, Olivier</creator><creator>DHINDSA, Rajinder</creator><creator>ROGERS, James</creator><creator>RAMASWAMY, Kartik</creator><creator>BYUN, Daniel Sang</creator><creator>DORF, Leonid</creator><creator>GUO, Yue</creator><creator>TODOROW, Valentin N</creator><creator>KAMENETSKIY, Evgeny</creator><creator>Cui, Linying</creator><scope>EVB</scope></search><sort><creationdate>20220203</creationdate><title>PLASMA PROCESSING ASSEMBLY USING PULSED-VOLTAGE AND RADIO-FREQUENCY POWER</title><author>LUERE, Olivier ; DHINDSA, Rajinder ; ROGERS, James ; RAMASWAMY, Kartik ; BYUN, Daniel Sang ; DORF, Leonid ; GUO, Yue ; TODOROW, Valentin N ; KAMENETSKIY, Evgeny ; Cui, Linying</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_US2022037119A13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2022</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS</topic><topic>ELECTRICITY</topic><toplevel>online_resources</toplevel><creatorcontrib>LUERE, Olivier</creatorcontrib><creatorcontrib>DHINDSA, Rajinder</creatorcontrib><creatorcontrib>ROGERS, James</creatorcontrib><creatorcontrib>RAMASWAMY, Kartik</creatorcontrib><creatorcontrib>BYUN, Daniel Sang</creatorcontrib><creatorcontrib>DORF, Leonid</creatorcontrib><creatorcontrib>GUO, Yue</creatorcontrib><creatorcontrib>TODOROW, Valentin N</creatorcontrib><creatorcontrib>KAMENETSKIY, Evgeny</creatorcontrib><creatorcontrib>Cui, Linying</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>LUERE, Olivier</au><au>DHINDSA, Rajinder</au><au>ROGERS, James</au><au>RAMASWAMY, Kartik</au><au>BYUN, Daniel Sang</au><au>DORF, Leonid</au><au>GUO, Yue</au><au>TODOROW, Valentin N</au><au>KAMENETSKIY, Evgeny</au><au>Cui, Linying</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>PLASMA PROCESSING ASSEMBLY USING PULSED-VOLTAGE AND RADIO-FREQUENCY POWER</title><date>2022-02-03</date><risdate>2022</risdate><abstract>Embodiments of the disclosure provided herein include an apparatus and method for the plasma processing of a substrate in a processing chamber. More specifically, embodiments of this disclosure describe a biasing scheme that is configured to provide a radio frequency (RF) generated RF waveform from an RF generator to one or more electrodes within a processing chamber and a pulsed-voltage (PV) waveform delivered from one or more pulsed-voltage (PV) generators to the one or more electrodes within the processing chamber. The plasma process(es) disclosed herein can be used to control the shape of an ion energy distribution function (IEDF) and the interaction of the plasma with a surface of a substrate during plasma processing.</abstract><oa>free_for_read</oa></addata></record>
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subjects BASIC ELECTRIC ELEMENTS
ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
ELECTRICITY
title PLASMA PROCESSING ASSEMBLY USING PULSED-VOLTAGE AND RADIO-FREQUENCY POWER
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