Component Carrier With Protruding Thermally Conductive Tongue and Corresponding Method of Manufacturing

Component Carrier With Protruding Thermally Conductive Tongue and Corresponding Method of Manufacturing

A method of manufacturing a component carrier includes (i) forming a stack having at least one electrically conductive layer structure and/or at least one electrically insulating layer structure; (ii) assembling a component to the stack; and (iii) forming a thermally conductive tongue having an embe...

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Hauptverfasser: Liebfahrt, Sabine, Yi, Raymond, Vockenberger, Christian, Lutschounig, Ferdinand, Yokoi, Naoto, Reitmaier, Bernhard
Format: Patent
Sprache:eng
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CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
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creator Liebfahrt, Sabine
Yi, Raymond
Vockenberger, Christian
Lutschounig, Ferdinand
Yokoi, Naoto
Reitmaier, Bernhard
description A method of manufacturing a component carrier includes (i) forming a stack having at least one electrically conductive layer structure and/or at least one electrically insulating layer structure; (ii) assembling a component to the stack; and (iii) forming a thermally conductive tongue having an embedded portion embedded in the stack and having an exposed portion protruding beyond the stack, where a first width of the tongue in the embedded portion is different from a second width of the tongue in the exposed portion. A corresponding component carrier includes analogous features.
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subjects CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
title Component Carrier With Protruding Thermally Conductive Tongue and Corresponding Method of Manufacturing
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