CIRCUIT BOARDS FOR HIGH-POWER APPLICATIONS
To support a large current, a circuit board may be a hybrid card, with a signal portion formed using a conventional PCB manufacturing techniques and a power portion formed with one or more blades mechanically coupled to the signal portion. The blade (s) may be metal plates. The hybrid card may be us...
Gespeichert in:
| Hauptverfasser: | , , , , |
|---|---|
| Format: | Patent |
| Sprache: | eng |
| Schlagworte: | |
| Online-Zugang: | Volltext bestellen |
| Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
| container_end_page | |
|---|---|
| container_issue | |
| container_start_page | |
| container_title | |
| container_volume | |
| creator | Zou, Chao Fry, Clarence Randall Copper, Charles Guo, Rongzhe Fry, JR., Rupert |
| description | To support a large current, a circuit board may be a hybrid card, with a signal portion formed using a conventional PCB manufacturing techniques and a power portion formed with one or more blades mechanically coupled to the signal portion. The blade (s) may be metal plates. The hybrid card may be usable with a hybrid edge connector that includes an insulative housing with a slot lined with signal terminals, in a signal portion, and power terminals in a power portion. The power terminals may be made with multiple layers, with each layer formed into one or more fingers. Each finger may be configured to make contact with an edge of a blade inserted in the slot such that each terminal has multiple contact points to the blade and can carry a large current. The slot in the connector housing may have different widths in the signal and power portions and the center lines of those portions may be offset with respect to each other. |
| format | Patent |
| fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_US2022021142A1</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>US2022021142A1</sourcerecordid><originalsourceid>FETCH-epo_espacenet_US2022021142A13</originalsourceid><addsrcrecordid>eNrjZNBy9gxyDvUMUXDydwxyCVZw8w9S8PB099AN8A93DVJwDAjw8XR2DPH09wvmYWBNS8wpTuWF0twMym6uIc4euqkF-fGpxQWJyal5qSXxocFGBkZAZGhoYuRoaEycKgDgPyV7</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>CIRCUIT BOARDS FOR HIGH-POWER APPLICATIONS</title><source>esp@cenet</source><creator>Zou, Chao ; Fry, Clarence Randall ; Copper, Charles ; Guo, Rongzhe ; Fry, JR., Rupert</creator><creatorcontrib>Zou, Chao ; Fry, Clarence Randall ; Copper, Charles ; Guo, Rongzhe ; Fry, JR., Rupert</creatorcontrib><description>To support a large current, a circuit board may be a hybrid card, with a signal portion formed using a conventional PCB manufacturing techniques and a power portion formed with one or more blades mechanically coupled to the signal portion. The blade (s) may be metal plates. The hybrid card may be usable with a hybrid edge connector that includes an insulative housing with a slot lined with signal terminals, in a signal portion, and power terminals in a power portion. The power terminals may be made with multiple layers, with each layer formed into one or more fingers. Each finger may be configured to make contact with an edge of a blade inserted in the slot such that each terminal has multiple contact points to the blade and can carry a large current. The slot in the connector housing may have different widths in the signal and power portions and the center lines of those portions may be offset with respect to each other.</description><language>eng</language><subject>BASIC ELECTRIC ELEMENTS ; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; CURRENT COLLECTORS ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; LINE CONNECTORS ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; PRINTED CIRCUITS</subject><creationdate>2022</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20220120&DB=EPODOC&CC=US&NR=2022021142A1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20220120&DB=EPODOC&CC=US&NR=2022021142A1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>Zou, Chao</creatorcontrib><creatorcontrib>Fry, Clarence Randall</creatorcontrib><creatorcontrib>Copper, Charles</creatorcontrib><creatorcontrib>Guo, Rongzhe</creatorcontrib><creatorcontrib>Fry, JR., Rupert</creatorcontrib><title>CIRCUIT BOARDS FOR HIGH-POWER APPLICATIONS</title><description>To support a large current, a circuit board may be a hybrid card, with a signal portion formed using a conventional PCB manufacturing techniques and a power portion formed with one or more blades mechanically coupled to the signal portion. The blade (s) may be metal plates. The hybrid card may be usable with a hybrid edge connector that includes an insulative housing with a slot lined with signal terminals, in a signal portion, and power terminals in a power portion. The power terminals may be made with multiple layers, with each layer formed into one or more fingers. Each finger may be configured to make contact with an edge of a blade inserted in the slot such that each terminal has multiple contact points to the blade and can carry a large current. The slot in the connector housing may have different widths in the signal and power portions and the center lines of those portions may be offset with respect to each other.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>CURRENT COLLECTORS</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>LINE CONNECTORS</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>PRINTED CIRCUITS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2022</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZNBy9gxyDvUMUXDydwxyCVZw8w9S8PB099AN8A93DVJwDAjw8XR2DPH09wvmYWBNS8wpTuWF0twMym6uIc4euqkF-fGpxQWJyal5qSXxocFGBkZAZGhoYuRoaEycKgDgPyV7</recordid><startdate>20220120</startdate><enddate>20220120</enddate><creator>Zou, Chao</creator><creator>Fry, Clarence Randall</creator><creator>Copper, Charles</creator><creator>Guo, Rongzhe</creator><creator>Fry, JR., Rupert</creator><scope>EVB</scope></search><sort><creationdate>20220120</creationdate><title>CIRCUIT BOARDS FOR HIGH-POWER APPLICATIONS</title><author>Zou, Chao ; Fry, Clarence Randall ; Copper, Charles ; Guo, Rongzhe ; Fry, JR., Rupert</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_US2022021142A13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2022</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>CURRENT COLLECTORS</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>LINE CONNECTORS</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>PRINTED CIRCUITS</topic><toplevel>online_resources</toplevel><creatorcontrib>Zou, Chao</creatorcontrib><creatorcontrib>Fry, Clarence Randall</creatorcontrib><creatorcontrib>Copper, Charles</creatorcontrib><creatorcontrib>Guo, Rongzhe</creatorcontrib><creatorcontrib>Fry, JR., Rupert</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>Zou, Chao</au><au>Fry, Clarence Randall</au><au>Copper, Charles</au><au>Guo, Rongzhe</au><au>Fry, JR., Rupert</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>CIRCUIT BOARDS FOR HIGH-POWER APPLICATIONS</title><date>2022-01-20</date><risdate>2022</risdate><abstract>To support a large current, a circuit board may be a hybrid card, with a signal portion formed using a conventional PCB manufacturing techniques and a power portion formed with one or more blades mechanically coupled to the signal portion. The blade (s) may be metal plates. The hybrid card may be usable with a hybrid edge connector that includes an insulative housing with a slot lined with signal terminals, in a signal portion, and power terminals in a power portion. The power terminals may be made with multiple layers, with each layer formed into one or more fingers. Each finger may be configured to make contact with an edge of a blade inserted in the slot such that each terminal has multiple contact points to the blade and can carry a large current. The slot in the connector housing may have different widths in the signal and power portions and the center lines of those portions may be offset with respect to each other.</abstract><oa>free_for_read</oa></addata></record> |
| fulltext | fulltext_linktorsrc |
| identifier | |
| ispartof | |
| issn | |
| language | eng |
| recordid | cdi_epo_espacenet_US2022021142A1 |
| source | esp@cenet |
| subjects | BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CURRENT COLLECTORS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY LINE CONNECTORS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS |
| title | CIRCUIT BOARDS FOR HIGH-POWER APPLICATIONS |
| url | https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-01T14%3A14%3A37IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=Zou,%20Chao&rft.date=2022-01-20&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EUS2022021142A1%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true |