PACKAGED CHIP AND METHOD FOR MANUFACTURING PACKAGED CHIP

Embodiments of this application disclose a packaged chip and a method for manufacturing a packaged chip. The packaged chip includes a substrate, a chip, and a heat sink. The heat sink includes a first bracket, a second bracket, and a cover. The first bracket and the second bracket are disposed on th...

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Bibliographische Detailangaben
Hauptverfasser: LU, Jianbiao, TAO, Junlei, HU, Xiao, CHIANG, Shanghsuan, JIANG, Yu, ZHAO, Nan, ZHENG, Jiantao
Format: Patent
Sprache:eng
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Beschreibung
Zusammenfassung:Embodiments of this application disclose a packaged chip and a method for manufacturing a packaged chip. The packaged chip includes a substrate, a chip, and a heat sink. The heat sink includes a first bracket, a second bracket, and a cover. The first bracket and the second bracket are disposed on the substrate. The cover is supported on the substrate by the first bracket and the second bracket. The first bracket is a sealed annular bracket. The first bracket and the cover encircle a first space. The chip is accommodated in the first space. A thermal interface material is disposed between the chip and the cover. A hole connected to the first space is provided on the cover. The hole and the first space are filled with a filling material. The second bracket is located outside the first space.