SEMICONDUCTOR PACKAGE

A semiconductor package includes a first semiconductor chip comprising a semiconductor substrate and a redistribution pattern on a top surface of the semiconductor substrate, the redistribution pattern having a hole exposing an inner sidewall of the redistribution pattern, a second semiconductor chi...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	YEON, SEUNGHOON, KIM, NAMHOON, JO, CHAJEA, KIM, HYOEUN, KWON, Ohguk
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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