SEMICONDUCTOR PACKAGE

A semiconductor package includes: a first redistribution structure having a first surface and a second surface opposing the first surface, and including a first insulating layer and a first redistribution layer disposed on the first insulating layer; a semiconductor chip disposed on the first surfac...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	KO, Youngchan, KIM, Jeongseok, KANG, Myungsam, CHO, Bongju
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
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