SEMICONDUCTOR MODULE AND SEMICONDUCTOR DEVICE USED THEREFOR

A semiconductor module includes a first heat sink member, a semiconductor device, a second heat sink member, a lead frame, a second sealing member. The semiconductor device includes a semiconductor element, a first sealing member for covering the semiconductor element, a first wiring and a second wi...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	TAKENAKA, Masayuki, OSAWA, Seigo, MIZUNO, Naohito, OKURA, Yasushi, NAKANO, Takahiro, INUTSUKA, Yoshihiro
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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