SEMICONDUCTOR MODULE AND SEMICONDUCTOR DEVICE USED THEREFOR

SEMICONDUCTOR MODULE AND SEMICONDUCTOR DEVICE USED THEREFOR

A semiconductor module includes a first heat sink member, a semiconductor device, a second heat sink member, a lead frame, a second sealing member. The semiconductor device includes a semiconductor element, a first sealing member for covering the semiconductor element, a first wiring and a second wi...

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Hauptverfasser: TAKENAKA, Masayuki, OSAWA, Seigo, MIZUNO, Naohito, OKURA, Yasushi, NAKANO, Takahiro, INUTSUKA, Yoshihiro
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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creator TAKENAKA, Masayuki
OSAWA, Seigo
MIZUNO, Naohito
OKURA, Yasushi
NAKANO, Takahiro
INUTSUKA, Yoshihiro
description A semiconductor module includes a first heat sink member, a semiconductor device, a second heat sink member, a lead frame, a second sealing member. The semiconductor device includes a semiconductor element, a first sealing member for covering the semiconductor element, a first wiring and a second wiring electrically connected to the semiconductor element, and a rewiring layer on the semiconductor element and the sealing member. The second heat sink member is disposed on the semiconductor device. The lead frame is electrically connected to the semiconductor device through a bonding member. The second sealing member covers a portion of the first heat sink member, the semiconductor and a portion of the second heat sink member. A surface of the second heat sink member faces the semiconductor device. The semiconductor device has a portion protruded from an outline of the second surface sink member.
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fullrecord <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_US2022005743A1</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>US2022005743A1</sourcerecordid><originalsourceid>FETCH-epo_espacenet_US2022005743A13</originalsourceid><addsrcrecordid>eNrjZLAOdvX1dPb3cwl1DvEPUvD1dwn1cVVw9HNRQJVwcQ3zdHZVCA12dVEI8XANcnXzD-JhYE1LzClO5YXS3AzKbq4hzh66qQX58anFBYnJqXmpJfGhwUYGRkYGBqbmJsaOhsbEqQIAnJEqXw</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>SEMICONDUCTOR MODULE AND SEMICONDUCTOR DEVICE USED THEREFOR</title><source>esp@cenet</source><creator>TAKENAKA, Masayuki ; OSAWA, Seigo ; MIZUNO, Naohito ; OKURA, Yasushi ; NAKANO, Takahiro ; INUTSUKA, Yoshihiro</creator><creatorcontrib>TAKENAKA, Masayuki ; OSAWA, Seigo ; MIZUNO, Naohito ; OKURA, Yasushi ; NAKANO, Takahiro ; INUTSUKA, Yoshihiro</creatorcontrib><description>A semiconductor module includes a first heat sink member, a semiconductor device, a second heat sink member, a lead frame, a second sealing member. The semiconductor device includes a semiconductor element, a first sealing member for covering the semiconductor element, a first wiring and a second wiring electrically connected to the semiconductor element, and a rewiring layer on the semiconductor element and the sealing member. The second heat sink member is disposed on the semiconductor device. The lead frame is electrically connected to the semiconductor device through a bonding member. The second sealing member covers a portion of the first heat sink member, the semiconductor and a portion of the second heat sink member. A surface of the second heat sink member faces the semiconductor device. The semiconductor device has a portion protruded from an outline of the second surface sink member.</description><language>eng</language><subject>BASIC ELECTRIC ELEMENTS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; SEMICONDUCTOR DEVICES</subject><creationdate>2022</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20220106&amp;DB=EPODOC&amp;CC=US&amp;NR=2022005743A1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76289</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20220106&amp;DB=EPODOC&amp;CC=US&amp;NR=2022005743A1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>TAKENAKA, Masayuki</creatorcontrib><creatorcontrib>OSAWA, Seigo</creatorcontrib><creatorcontrib>MIZUNO, Naohito</creatorcontrib><creatorcontrib>OKURA, Yasushi</creatorcontrib><creatorcontrib>NAKANO, Takahiro</creatorcontrib><creatorcontrib>INUTSUKA, Yoshihiro</creatorcontrib><title>SEMICONDUCTOR MODULE AND SEMICONDUCTOR DEVICE USED THEREFOR</title><description>A semiconductor module includes a first heat sink member, a semiconductor device, a second heat sink member, a lead frame, a second sealing member. The semiconductor device includes a semiconductor element, a first sealing member for covering the semiconductor element, a first wiring and a second wiring electrically connected to the semiconductor element, and a rewiring layer on the semiconductor element and the sealing member. The second heat sink member is disposed on the semiconductor device. The lead frame is electrically connected to the semiconductor device through a bonding member. The second sealing member covers a portion of the first heat sink member, the semiconductor and a portion of the second heat sink member. A surface of the second heat sink member faces the semiconductor device. The semiconductor device has a portion protruded from an outline of the second surface sink member.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2022</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZLAOdvX1dPb3cwl1DvEPUvD1dwn1cVVw9HNRQJVwcQ3zdHZVCA12dVEI8XANcnXzD-JhYE1LzClO5YXS3AzKbq4hzh66qQX58anFBYnJqXmpJfGhwUYGRkYGBqbmJsaOhsbEqQIAnJEqXw</recordid><startdate>20220106</startdate><enddate>20220106</enddate><creator>TAKENAKA, Masayuki</creator><creator>OSAWA, Seigo</creator><creator>MIZUNO, Naohito</creator><creator>OKURA, Yasushi</creator><creator>NAKANO, Takahiro</creator><creator>INUTSUKA, Yoshihiro</creator><scope>EVB</scope></search><sort><creationdate>20220106</creationdate><title>SEMICONDUCTOR MODULE AND SEMICONDUCTOR DEVICE USED THEREFOR</title><author>TAKENAKA, Masayuki ; OSAWA, Seigo ; MIZUNO, Naohito ; OKURA, Yasushi ; NAKANO, Takahiro ; INUTSUKA, Yoshihiro</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_US2022005743A13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2022</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>TAKENAKA, Masayuki</creatorcontrib><creatorcontrib>OSAWA, Seigo</creatorcontrib><creatorcontrib>MIZUNO, Naohito</creatorcontrib><creatorcontrib>OKURA, Yasushi</creatorcontrib><creatorcontrib>NAKANO, Takahiro</creatorcontrib><creatorcontrib>INUTSUKA, Yoshihiro</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>TAKENAKA, Masayuki</au><au>OSAWA, Seigo</au><au>MIZUNO, Naohito</au><au>OKURA, Yasushi</au><au>NAKANO, Takahiro</au><au>INUTSUKA, Yoshihiro</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>SEMICONDUCTOR MODULE AND SEMICONDUCTOR DEVICE USED THEREFOR</title><date>2022-01-06</date><risdate>2022</risdate><abstract>A semiconductor module includes a first heat sink member, a semiconductor device, a second heat sink member, a lead frame, a second sealing member. The semiconductor device includes a semiconductor element, a first sealing member for covering the semiconductor element, a first wiring and a second wiring electrically connected to the semiconductor element, and a rewiring layer on the semiconductor element and the sealing member. The second heat sink member is disposed on the semiconductor device. The lead frame is electrically connected to the semiconductor device through a bonding member. The second sealing member covers a portion of the first heat sink member, the semiconductor and a portion of the second heat sink member. A surface of the second heat sink member faces the semiconductor device. The semiconductor device has a portion protruded from an outline of the second surface sink member.</abstract><oa>free_for_read</oa></addata></record>
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subjects BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
title SEMICONDUCTOR MODULE AND SEMICONDUCTOR DEVICE USED THEREFOR
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-02-09T15%3A29%3A34IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=TAKENAKA,%20Masayuki&rft.date=2022-01-06&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EUS2022005743A1%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true