APPARATUS AND METHOD FOR CMP TEMPERATURE CONTROL

A chemical mechanical polishing apparatus includes a rotatable platen to hold a polishing pad, a carrier to hold a substrate against a polishing surface of the polishing pad during a polishing process, and a temperature control system including a source of heated or coolant fluid and a plenum having...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	Soundararajan, Hari, Chen, Hui, Kumar, Surajit, Chang, Shou-Sung
Format:	Patent
Sprache:	eng
Schlagworte:	DRESSING OR CONDITIONING OF ABRADING SURFACES FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS GRINDING MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING PERFORMING OPERATIONS POLISHING TRANSPORTING
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