ADAPTER BOARD AND METHOD FOR FORMING SAME, PACKAGING METHOD, AND PACKAGE STRUCTURE

Provided are an adapter board and a method for forming the same, a packaging method, and a package structure. One form of a method for forming an adapter board includes: providing a base, including an interconnect region and a capacitor region, the base including a front surface and a rear surface t...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	Lie Yong, Yang, Qiaoming, Cai, Xiao Yu, Lu, Wei, Chen
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!