RELIABLE SEMICONDUCTOR PACKAGES

Semiconductor packages and methods for forming thereof are disclosed. The semiconductor package includes a package substrate having a die attach region with a die attached thereto. A protective cover is disposed over a sensor region of the die and attached to the die by a cover adhesive. The cover a...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	FABIAN, Mario Arwin Simon, TRESNADO, Dennis Fernandez, ILAGAN, Allan Pumatong, MICLA, Wedanni Linsangan
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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