Impinging Jet Manifold For Chip Cooling Near Edge Jets

Systems and methods for chip cooling with near edge jets in a direct liquid cooled module are disclosed. One of the functions of a direct liquid cooled module is to provide cooling liquid to components located on a chip. Jet impingement directly onto the back side of a chip is one cooling method tha...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: Rice, Jeremy, Fraisse, Evan, Spaulding, Jeffrey Scott
Format: Patent
Sprache:eng
Schlagworte:
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
container_end_page
container_issue
container_start_page
container_title
container_volume
creator Rice, Jeremy
Fraisse, Evan
Spaulding, Jeffrey Scott
description Systems and methods for chip cooling with near edge jets in a direct liquid cooled module are disclosed. One of the functions of a direct liquid cooled module is to provide cooling liquid to components located on a chip. Jet impingement directly onto the back side of a chip is one cooling method that can provide more efficient cooling. An orifice plate includes an array of small diameter holes that correspond to high velocity jet locations and large diameter holes for the insertion of tubes to connect to lower pressure cavities.
format Patent
fullrecord <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_US2021378139A1</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>US2021378139A1</sourcerecordid><originalsourceid>FETCH-epo_espacenet_US2021378139A13</originalsourceid><addsrcrecordid>eNrjZDDzzC3IzEsHIgWv1BIF38S8zLT8nBQFt_wiBeeMzAIF5_z8HJCsX2pikYJrSnoqSF0xDwNrWmJOcSovlOZmUHZzDXH20E0tyI9PLS5ITE7NSy2JDw02MjAyNDa3MDS2dDQ0Jk4VAK7-LQ8</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Impinging Jet Manifold For Chip Cooling Near Edge Jets</title><source>esp@cenet</source><creator>Rice, Jeremy ; Fraisse, Evan ; Spaulding, Jeffrey Scott</creator><creatorcontrib>Rice, Jeremy ; Fraisse, Evan ; Spaulding, Jeffrey Scott</creatorcontrib><description>Systems and methods for chip cooling with near edge jets in a direct liquid cooled module are disclosed. One of the functions of a direct liquid cooled module is to provide cooling liquid to components located on a chip. Jet impingement directly onto the back side of a chip is one cooling method that can provide more efficient cooling. An orifice plate includes an array of small diameter holes that correspond to high velocity jet locations and large diameter holes for the insertion of tubes to connect to lower pressure cavities.</description><language>eng</language><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; PRINTED CIRCUITS</subject><creationdate>2021</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20211202&amp;DB=EPODOC&amp;CC=US&amp;NR=2021378139A1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20211202&amp;DB=EPODOC&amp;CC=US&amp;NR=2021378139A1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>Rice, Jeremy</creatorcontrib><creatorcontrib>Fraisse, Evan</creatorcontrib><creatorcontrib>Spaulding, Jeffrey Scott</creatorcontrib><title>Impinging Jet Manifold For Chip Cooling Near Edge Jets</title><description>Systems and methods for chip cooling with near edge jets in a direct liquid cooled module are disclosed. One of the functions of a direct liquid cooled module is to provide cooling liquid to components located on a chip. Jet impingement directly onto the back side of a chip is one cooling method that can provide more efficient cooling. An orifice plate includes an array of small diameter holes that correspond to high velocity jet locations and large diameter holes for the insertion of tubes to connect to lower pressure cavities.</description><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>PRINTED CIRCUITS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2021</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZDDzzC3IzEsHIgWv1BIF38S8zLT8nBQFt_wiBeeMzAIF5_z8HJCsX2pikYJrSnoqSF0xDwNrWmJOcSovlOZmUHZzDXH20E0tyI9PLS5ITE7NSy2JDw02MjAyNDa3MDS2dDQ0Jk4VAK7-LQ8</recordid><startdate>20211202</startdate><enddate>20211202</enddate><creator>Rice, Jeremy</creator><creator>Fraisse, Evan</creator><creator>Spaulding, Jeffrey Scott</creator><scope>EVB</scope></search><sort><creationdate>20211202</creationdate><title>Impinging Jet Manifold For Chip Cooling Near Edge Jets</title><author>Rice, Jeremy ; Fraisse, Evan ; Spaulding, Jeffrey Scott</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_US2021378139A13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2021</creationdate><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>PRINTED CIRCUITS</topic><toplevel>online_resources</toplevel><creatorcontrib>Rice, Jeremy</creatorcontrib><creatorcontrib>Fraisse, Evan</creatorcontrib><creatorcontrib>Spaulding, Jeffrey Scott</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>Rice, Jeremy</au><au>Fraisse, Evan</au><au>Spaulding, Jeffrey Scott</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Impinging Jet Manifold For Chip Cooling Near Edge Jets</title><date>2021-12-02</date><risdate>2021</risdate><abstract>Systems and methods for chip cooling with near edge jets in a direct liquid cooled module are disclosed. One of the functions of a direct liquid cooled module is to provide cooling liquid to components located on a chip. Jet impingement directly onto the back side of a chip is one cooling method that can provide more efficient cooling. An orifice plate includes an array of small diameter holes that correspond to high velocity jet locations and large diameter holes for the insertion of tubes to connect to lower pressure cavities.</abstract><oa>free_for_read</oa></addata></record>
fulltext fulltext_linktorsrc
identifier
ispartof
issn
language eng
recordid cdi_epo_espacenet_US2021378139A1
source esp@cenet
subjects CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
title Impinging Jet Manifold For Chip Cooling Near Edge Jets
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-07T00%3A31%3A15IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=Rice,%20Jeremy&rft.date=2021-12-02&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EUS2021378139A1%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true