ELECTRONIC COMPONENT, CIRCUIT BOARD ARRANGEMENT AND METHOD OF MANUFACTURING ELECTRONIC COMPONENT
An electronic component includes an element body and at least one external electrode thereon. The element body has a dielectric and inner electrodes. Each external electrode includes a base layer connected to at least one the inner electrode. The base layer is formed on a plurality of surfaces of th...
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Zusammenfassung: | An electronic component includes an element body and at least one external electrode thereon. The element body has a dielectric and inner electrodes. Each external electrode includes a base layer connected to at least one the inner electrode. The base layer is formed on a plurality of surfaces of the element body and contains a metal and a first co-material mixed with the metal. Each external electrode also includes a plating layer formed on at least one face of the base layer. Each external electrode also includes an oxide layer formed on one or more faces of the base layer other than those faces of the base layer on which the plating layer is formed. The oxide layer has a surface layer made from an oxide film of the metal of the base layer and a second co-material. |
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