DEVICE HAVING RESIN SUBSTRATE AND MANUFACTURING METHOD THEREOF
The purpose of the invention is to manufacture the device having a resin substrate without using expensive machine like laser apparatus and so forth, and to raise a yield rate of the material. The structure is as follows.A device having a resin substrate:in which the resin substrate has a surface, o...
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| creator | KAWANAGO, Hiroshi |
| description | The purpose of the invention is to manufacture the device having a resin substrate without using expensive machine like laser apparatus and so forth, and to raise a yield rate of the material. The structure is as follows.A device having a resin substrate:in which the resin substrate has a surface, on which a functional layer is formed, and a back surface, which is rear side from the surface,the back surface has a peripheral area and an inner area, which is located inner side than the peripheral area in a plan view,the peripheral area has a rough surface whose surface roughness is larger compared with a surface roughness of the inner area. |
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| fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_US2021367172A1</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>US2021367172A1</sourcerecordid><originalsourceid>FETCH-epo_espacenet_US2021367172A13</originalsourceid><addsrcrecordid>eNrjZLBzcQ3zdHZV8HAM8_RzVwhyDfb0UwgOdQoOCXIMcVVw9HNR8HX0C3VzdA4JDQKp8HUN8fB3UQjxcA1y9XfjYWBNS8wpTuWF0twMym6uIc4euqkF-fGpxQWJyal5qSXxocFGBkaGxmbmhuZGjobGxKkCAARGKxc</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>DEVICE HAVING RESIN SUBSTRATE AND MANUFACTURING METHOD THEREOF</title><source>esp@cenet</source><creator>KAWANAGO, Hiroshi</creator><creatorcontrib>KAWANAGO, Hiroshi</creatorcontrib><description>The purpose of the invention is to manufacture the device having a resin substrate without using expensive machine like laser apparatus and so forth, and to raise a yield rate of the material. The structure is as follows.A device having a resin substrate:in which the resin substrate has a surface, on which a functional layer is formed, and a back surface, which is rear side from the surface,the back surface has a peripheral area and an inner area, which is located inner side than the peripheral area in a plan view,the peripheral area has a rough surface whose surface roughness is larger compared with a surface roughness of the inner area.</description><language>eng</language><subject>CHEMICAL COMPOSITION OF GLASSES, GLAZES, OR VITREOUSENAMELS ; CHEMISTRY ; ELECTRICITY ; GLASS ; JOINING GLASS TO GLASS OR OTHER MATERIALS ; METALLURGY ; MINERAL OR SLAG WOOL ; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS,MINERALS OR SLAGS ; SURFACE TREATMENT OF GLASS</subject><creationdate>2021</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20211125&DB=EPODOC&CC=US&NR=2021367172A1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76290</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20211125&DB=EPODOC&CC=US&NR=2021367172A1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>KAWANAGO, Hiroshi</creatorcontrib><title>DEVICE HAVING RESIN SUBSTRATE AND MANUFACTURING METHOD THEREOF</title><description>The purpose of the invention is to manufacture the device having a resin substrate without using expensive machine like laser apparatus and so forth, and to raise a yield rate of the material. The structure is as follows.A device having a resin substrate:in which the resin substrate has a surface, on which a functional layer is formed, and a back surface, which is rear side from the surface,the back surface has a peripheral area and an inner area, which is located inner side than the peripheral area in a plan view,the peripheral area has a rough surface whose surface roughness is larger compared with a surface roughness of the inner area.</description><subject>CHEMICAL COMPOSITION OF GLASSES, GLAZES, OR VITREOUSENAMELS</subject><subject>CHEMISTRY</subject><subject>ELECTRICITY</subject><subject>GLASS</subject><subject>JOINING GLASS TO GLASS OR OTHER MATERIALS</subject><subject>METALLURGY</subject><subject>MINERAL OR SLAG WOOL</subject><subject>SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS,MINERALS OR SLAGS</subject><subject>SURFACE TREATMENT OF GLASS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2021</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZLBzcQ3zdHZV8HAM8_RzVwhyDfb0UwgOdQoOCXIMcVVw9HNR8HX0C3VzdA4JDQKp8HUN8fB3UQjxcA1y9XfjYWBNS8wpTuWF0twMym6uIc4euqkF-fGpxQWJyal5qSXxocFGBkaGxmbmhuZGjobGxKkCAARGKxc</recordid><startdate>20211125</startdate><enddate>20211125</enddate><creator>KAWANAGO, Hiroshi</creator><scope>EVB</scope></search><sort><creationdate>20211125</creationdate><title>DEVICE HAVING RESIN SUBSTRATE AND MANUFACTURING METHOD THEREOF</title><author>KAWANAGO, Hiroshi</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_US2021367172A13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2021</creationdate><topic>CHEMICAL COMPOSITION OF GLASSES, GLAZES, OR VITREOUSENAMELS</topic><topic>CHEMISTRY</topic><topic>ELECTRICITY</topic><topic>GLASS</topic><topic>JOINING GLASS TO GLASS OR OTHER MATERIALS</topic><topic>METALLURGY</topic><topic>MINERAL OR SLAG WOOL</topic><topic>SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS,MINERALS OR SLAGS</topic><topic>SURFACE TREATMENT OF GLASS</topic><toplevel>online_resources</toplevel><creatorcontrib>KAWANAGO, Hiroshi</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>KAWANAGO, Hiroshi</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>DEVICE HAVING RESIN SUBSTRATE AND MANUFACTURING METHOD THEREOF</title><date>2021-11-25</date><risdate>2021</risdate><abstract>The purpose of the invention is to manufacture the device having a resin substrate without using expensive machine like laser apparatus and so forth, and to raise a yield rate of the material. The structure is as follows.A device having a resin substrate:in which the resin substrate has a surface, on which a functional layer is formed, and a back surface, which is rear side from the surface,the back surface has a peripheral area and an inner area, which is located inner side than the peripheral area in a plan view,the peripheral area has a rough surface whose surface roughness is larger compared with a surface roughness of the inner area.</abstract><oa>free_for_read</oa></addata></record> |
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| language | eng |
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| subjects | CHEMICAL COMPOSITION OF GLASSES, GLAZES, OR VITREOUSENAMELS CHEMISTRY ELECTRICITY GLASS JOINING GLASS TO GLASS OR OTHER MATERIALS METALLURGY MINERAL OR SLAG WOOL SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS,MINERALS OR SLAGS SURFACE TREATMENT OF GLASS |
| title | DEVICE HAVING RESIN SUBSTRATE AND MANUFACTURING METHOD THEREOF |
| url | https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-29T05%3A40%3A27IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=KAWANAGO,%20Hiroshi&rft.date=2021-11-25&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EUS2021367172A1%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true |