HIGH POWER MODULE PACKAGE STRUCTURES

A method includes disposing a semiconductor die between a first high voltage isolation carrier and a second high voltage isolation carrier, disposing a first molding material in a space between the semiconductor die and the first high voltage isolation carrier, and disposing a conductive spacer betw...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	TEYSSEYRE, Jerome, LIN, Yusheng
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
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