SEMICONDUCTOR DEVICE MANUFACTURING METHOD AND SCREEN
A printed circuit board has an in-pad via. In a first step, a component is mounted on a first surface of a printed circuit board. A screen to be used in a second step has openings at positions corresponding to those of a plurality of pads on a second surface and has a recess positioned to overlap an...
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creator | Wada, Katsushi Sasao, Kazuki |
description | A printed circuit board has an in-pad via. In a first step, a component is mounted on a first surface of a printed circuit board. A screen to be used in a second step has openings at positions corresponding to those of a plurality of pads on a second surface and has a recess positioned to overlap an in-pad via. Solder cream is applied from above the screen, and the screen is removed. Then, a component is mounted on the second surface. |
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fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_US2021345496A1</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>US2021345496A1</sourcerecordid><originalsourceid>FETCH-epo_espacenet_US2021345496A13</originalsourceid><addsrcrecordid>eNrjZDAJdvX1dPb3cwl1DvEPUnBxDfN0dlXwdfQLdXN0DgkN8vRzV_B1DfHwd1Fw9HNRCHYOcnX142FgTUvMKU7lhdLcDMpuriHOHrqpBfnxqcUFicmpeakl8aHBRgZGhsYmpiaWZo6GxsSpAgB1Fihu</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>SEMICONDUCTOR DEVICE MANUFACTURING METHOD AND SCREEN</title><source>esp@cenet</source><creator>Wada, Katsushi ; Sasao, Kazuki</creator><creatorcontrib>Wada, Katsushi ; Sasao, Kazuki</creatorcontrib><description>A printed circuit board has an in-pad via. In a first step, a component is mounted on a first surface of a printed circuit board. A screen to be used in a second step has openings at positions corresponding to those of a plurality of pads on a second surface and has a recess positioned to overlap an in-pad via. Solder cream is applied from above the screen, and the screen is removed. Then, a component is mounted on the second surface.</description><language>eng</language><subject>APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC,OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWERSUPPLY SYSTEMS ; BASIC ELECTRIC ELEMENTS ; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; CONTROL OR REGULATION THEREOF ; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUTPOWER ; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; GENERATION ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; PRINTED CIRCUITS ; SEMICONDUCTOR DEVICES</subject><creationdate>2021</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20211104&DB=EPODOC&CC=US&NR=2021345496A1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20211104&DB=EPODOC&CC=US&NR=2021345496A1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>Wada, Katsushi</creatorcontrib><creatorcontrib>Sasao, Kazuki</creatorcontrib><title>SEMICONDUCTOR DEVICE MANUFACTURING METHOD AND SCREEN</title><description>A printed circuit board has an in-pad via. In a first step, a component is mounted on a first surface of a printed circuit board. A screen to be used in a second step has openings at positions corresponding to those of a plurality of pads on a second surface and has a recess positioned to overlap an in-pad via. Solder cream is applied from above the screen, and the screen is removed. Then, a component is mounted on the second surface.</description><subject>APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC,OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWERSUPPLY SYSTEMS</subject><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>CONTROL OR REGULATION THEREOF</subject><subject>CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUTPOWER</subject><subject>CONVERSION OR DISTRIBUTION OF ELECTRIC POWER</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>GENERATION</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>PRINTED CIRCUITS</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2021</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZDAJdvX1dPb3cwl1DvEPUnBxDfN0dlXwdfQLdXN0DgkN8vRzV_B1DfHwd1Fw9HNRCHYOcnX142FgTUvMKU7lhdLcDMpuriHOHrqpBfnxqcUFicmpeakl8aHBRgZGhsYmpiaWZo6GxsSpAgB1Fihu</recordid><startdate>20211104</startdate><enddate>20211104</enddate><creator>Wada, Katsushi</creator><creator>Sasao, Kazuki</creator><scope>EVB</scope></search><sort><creationdate>20211104</creationdate><title>SEMICONDUCTOR DEVICE MANUFACTURING METHOD AND SCREEN</title><author>Wada, Katsushi ; Sasao, Kazuki</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_US2021345496A13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2021</creationdate><topic>APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC,OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWERSUPPLY SYSTEMS</topic><topic>BASIC ELECTRIC ELEMENTS</topic><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>CONTROL OR REGULATION THEREOF</topic><topic>CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUTPOWER</topic><topic>CONVERSION OR DISTRIBUTION OF ELECTRIC POWER</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>GENERATION</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>PRINTED CIRCUITS</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>Wada, Katsushi</creatorcontrib><creatorcontrib>Sasao, Kazuki</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>Wada, Katsushi</au><au>Sasao, Kazuki</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>SEMICONDUCTOR DEVICE MANUFACTURING METHOD AND SCREEN</title><date>2021-11-04</date><risdate>2021</risdate><abstract>A printed circuit board has an in-pad via. In a first step, a component is mounted on a first surface of a printed circuit board. A screen to be used in a second step has openings at positions corresponding to those of a plurality of pads on a second surface and has a recess positioned to overlap an in-pad via. Solder cream is applied from above the screen, and the screen is removed. Then, a component is mounted on the second surface.</abstract><oa>free_for_read</oa></addata></record> |
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subjects | APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC,OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWERSUPPLY SYSTEMS BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CONTROL OR REGULATION THEREOF CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUTPOWER CONVERSION OR DISTRIBUTION OF ELECTRIC POWER ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY GENERATION MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES |
title | SEMICONDUCTOR DEVICE MANUFACTURING METHOD AND SCREEN |
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