SEMICONDUCTOR DEVICE HAVING VIA PROTECTIVE LAYER

SEMICONDUCTOR DEVICE HAVING VIA PROTECTIVE LAYER

A semiconductor device is disclosed. The semiconductor device includes a via passivation layer disposed on an inactive surface of a substrate, a through-electrode vertically penetrating the substrate and the via passivation layer, a concave portion formed in the top surface of the via passivation la...

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Hauptverfasser: CHOI, Juil, AN, Jinho, CHUN, Jinho, PARK, Jumyong, SONG, Solji, JIN, Jeonggi
Format: Patent
Sprache:eng
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BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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creator CHOI, Juil
AN, Jinho
CHUN, Jinho
PARK, Jumyong
SONG, Solji
JIN, Jeonggi
description A semiconductor device is disclosed. The semiconductor device includes a via passivation layer disposed on an inactive surface of a substrate, a through-electrode vertically penetrating the substrate and the via passivation layer, a concave portion formed in the top surface of the via passivation layer and disposed adjacent to the through-electrode, and a via protective layer coplanar with the via passivation layer and the through-electrode and to fill the concave portion. In a horizontal cross-sectional view, the via protective layer has a band shape surrounding the through-electrode.
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subjects BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
title SEMICONDUCTOR DEVICE HAVING VIA PROTECTIVE LAYER
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