TRANSFER SUBSTRATE, METHOD OF FABRICATING MICRO LIGHT EMITTING DIODE DISPLAY SUBSTRATE, AND MICRO LIGHT EMITTING DIODE DISPLAY SUBSTRATE

A transfer substrate for transferring an array of a plurality of micro light emitting diodes (micro LEDs) onto a target substrate. The transfer substrate includes a base substrate and an array of a plurality of electroactive actuators. A respective one of the plurality of electroactive actuators inc...

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Hauptverfasser: Hou, Tingxiu, Du, Jingjun, Fang, Liyu, Sun, Lingyu, Liang, Fei
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creator Hou, Tingxiu
Du, Jingjun
Fang, Liyu
Sun, Lingyu
Liang, Fei
description A transfer substrate for transferring an array of a plurality of micro light emitting diodes (micro LEDs) onto a target substrate. The transfer substrate includes a base substrate and an array of a plurality of electroactive actuators. A respective one of the plurality of electroactive actuators includes a ring-shaped frame structure substantially surrounding a central opening, the ring-shaped frame structure made of an electroactive material. The ring-shaped frame structure is configured to undergo a reversible deformation between a first state and a second state upon a change in an electric field applied on the ring-shaped frame structure. A distance between two positions on an inner wall of the ring-shaped frame structure and across the central opening having a first value in the first state and a second value in the second state. The first value is greater than the second value.
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fullrecord <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_US2021335634A1</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>US2021335634A1</sourcerecordid><originalsourceid>FETCH-epo_espacenet_US2021335634A13</originalsourceid><addsrcrecordid>eNrjZOgICXL0C3ZzDVIIDnUKBnJCXHUUfF1DPPxdFPzdFNwcnYI8nR1DPP3cFXw9nYP8FXw83T1CFFx9PUPAgi6e_i6uQDI4wMcxEtkMRz8XknTwMLCmJeYUp_JCaW4GZTfXEGcP3dSC_PjU4oLE5NS81JL40GAjAyNDY2NTM2MTR0Nj4lQBAFJhP1A</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>TRANSFER SUBSTRATE, METHOD OF FABRICATING MICRO LIGHT EMITTING DIODE DISPLAY SUBSTRATE, AND MICRO LIGHT EMITTING DIODE DISPLAY SUBSTRATE</title><source>esp@cenet</source><creator>Hou, Tingxiu ; Du, Jingjun ; Fang, Liyu ; Sun, Lingyu ; Liang, Fei</creator><creatorcontrib>Hou, Tingxiu ; Du, Jingjun ; Fang, Liyu ; Sun, Lingyu ; Liang, Fei</creatorcontrib><description>A transfer substrate for transferring an array of a plurality of micro light emitting diodes (micro LEDs) onto a target substrate. The transfer substrate includes a base substrate and an array of a plurality of electroactive actuators. A respective one of the plurality of electroactive actuators includes a ring-shaped frame structure substantially surrounding a central opening, the ring-shaped frame structure made of an electroactive material. The ring-shaped frame structure is configured to undergo a reversible deformation between a first state and a second state upon a change in an electric field applied on the ring-shaped frame structure. A distance between two positions on an inner wall of the ring-shaped frame structure and across the central opening having a first value in the first state and a second value in the second state. The first value is greater than the second value.</description><language>eng</language><subject>BASIC ELECTRIC ELEMENTS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; SEMICONDUCTOR DEVICES</subject><creationdate>2021</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20211028&amp;DB=EPODOC&amp;CC=US&amp;NR=2021335634A1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25563,76318</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20211028&amp;DB=EPODOC&amp;CC=US&amp;NR=2021335634A1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>Hou, Tingxiu</creatorcontrib><creatorcontrib>Du, Jingjun</creatorcontrib><creatorcontrib>Fang, Liyu</creatorcontrib><creatorcontrib>Sun, Lingyu</creatorcontrib><creatorcontrib>Liang, Fei</creatorcontrib><title>TRANSFER SUBSTRATE, METHOD OF FABRICATING MICRO LIGHT EMITTING DIODE DISPLAY SUBSTRATE, AND MICRO LIGHT EMITTING DIODE DISPLAY SUBSTRATE</title><description>A transfer substrate for transferring an array of a plurality of micro light emitting diodes (micro LEDs) onto a target substrate. The transfer substrate includes a base substrate and an array of a plurality of electroactive actuators. A respective one of the plurality of electroactive actuators includes a ring-shaped frame structure substantially surrounding a central opening, the ring-shaped frame structure made of an electroactive material. The ring-shaped frame structure is configured to undergo a reversible deformation between a first state and a second state upon a change in an electric field applied on the ring-shaped frame structure. A distance between two positions on an inner wall of the ring-shaped frame structure and across the central opening having a first value in the first state and a second value in the second state. The first value is greater than the second value.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2021</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZOgICXL0C3ZzDVIIDnUKBnJCXHUUfF1DPPxdFPzdFNwcnYI8nR1DPP3cFXw9nYP8FXw83T1CFFx9PUPAgi6e_i6uQDI4wMcxEtkMRz8XknTwMLCmJeYUp_JCaW4GZTfXEGcP3dSC_PjU4oLE5NS81JL40GAjAyNDY2NTM2MTR0Nj4lQBAFJhP1A</recordid><startdate>20211028</startdate><enddate>20211028</enddate><creator>Hou, Tingxiu</creator><creator>Du, Jingjun</creator><creator>Fang, Liyu</creator><creator>Sun, Lingyu</creator><creator>Liang, Fei</creator><scope>EVB</scope></search><sort><creationdate>20211028</creationdate><title>TRANSFER SUBSTRATE, METHOD OF FABRICATING MICRO LIGHT EMITTING DIODE DISPLAY SUBSTRATE, AND MICRO LIGHT EMITTING DIODE DISPLAY SUBSTRATE</title><author>Hou, Tingxiu ; Du, Jingjun ; Fang, Liyu ; Sun, Lingyu ; Liang, Fei</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_US2021335634A13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2021</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>Hou, Tingxiu</creatorcontrib><creatorcontrib>Du, Jingjun</creatorcontrib><creatorcontrib>Fang, Liyu</creatorcontrib><creatorcontrib>Sun, Lingyu</creatorcontrib><creatorcontrib>Liang, Fei</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>Hou, Tingxiu</au><au>Du, Jingjun</au><au>Fang, Liyu</au><au>Sun, Lingyu</au><au>Liang, Fei</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>TRANSFER SUBSTRATE, METHOD OF FABRICATING MICRO LIGHT EMITTING DIODE DISPLAY SUBSTRATE, AND MICRO LIGHT EMITTING DIODE DISPLAY SUBSTRATE</title><date>2021-10-28</date><risdate>2021</risdate><abstract>A transfer substrate for transferring an array of a plurality of micro light emitting diodes (micro LEDs) onto a target substrate. The transfer substrate includes a base substrate and an array of a plurality of electroactive actuators. A respective one of the plurality of electroactive actuators includes a ring-shaped frame structure substantially surrounding a central opening, the ring-shaped frame structure made of an electroactive material. The ring-shaped frame structure is configured to undergo a reversible deformation between a first state and a second state upon a change in an electric field applied on the ring-shaped frame structure. A distance between two positions on an inner wall of the ring-shaped frame structure and across the central opening having a first value in the first state and a second value in the second state. The first value is greater than the second value.</abstract><oa>free_for_read</oa></addata></record>
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subjects BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
title TRANSFER SUBSTRATE, METHOD OF FABRICATING MICRO LIGHT EMITTING DIODE DISPLAY SUBSTRATE, AND MICRO LIGHT EMITTING DIODE DISPLAY SUBSTRATE
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-12T14%3A19%3A24IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=Hou,%20Tingxiu&rft.date=2021-10-28&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EUS2021335634A1%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true