HEAT AND HUMIDITY RESISTANT ADHESIVE COMPOSITION

This invention relates to a heat and humidity resistant adhesive composition, comprising a first part comprising at least one ethylenically unsaturated monomer; a second part comprising at least one initiator; and at least one blocked isocyanate compound comprised in the first part, the second part...

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Bibliographische Detailangaben
Hauptverfasser:	Shi, Zhuming, Chen, Jinqian, Lu, Cheng
Format:	Patent
Sprache:	eng
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES CHEMISTRY COMPOSITIONS BASED THEREON DYES MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL ORGANIC MACROMOLECULAR COMPOUNDS PAINTS POLISHES THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS USE OF MATERIALS AS ADHESIVES
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