METHOD FOR FABRICATING SEMICONDUCTOR DEVICE CHIPS AND PROTECTIVE COMPOSITION

A protective composition contains a water-soluble polyester resin including a polyvalent carboxylic acid residue and a polyvalent alcohol residue. The polyvalent carboxylic acid residue includes: a polyvalent carboxylic acid residue having a metal sulfonate group; and a naphthalene dicarboxylic acid...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: SAKAKIBARA, Teru, KARASAKI, Hidehiko, KOMABIKI, Shinya, MAEDA, Koji
Format: Patent
Sprache:eng
Schlagworte:
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
container_end_page
container_issue
container_start_page
container_title
container_volume
creator SAKAKIBARA, Teru
KARASAKI, Hidehiko
KOMABIKI, Shinya
MAEDA, Koji
description A protective composition contains a water-soluble polyester resin including a polyvalent carboxylic acid residue and a polyvalent alcohol residue. The polyvalent carboxylic acid residue includes: a polyvalent carboxylic acid residue having a metal sulfonate group; and a naphthalene dicarboxylic acid residue. The proportion of the polyvalent carboxylic acid residue to the polyvalent carboxylic acid residue falls within the range from 25 mol % to 70 mol %. The proportion of the naphthalene dicarboxylic acid residue to the polyvalent carboxylic acid residue falls within the range from 30 mol % to 75 mol %.
format Patent
fullrecord <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_US2021324226A1</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>US2021324226A1</sourcerecordid><originalsourceid>FETCH-epo_espacenet_US2021324226A13</originalsourceid><addsrcrecordid>eNqNirEKwjAUALM4iPoPAWfBpuIeXxLzwOSF5LVrKRIn0UL9f-zgBzgd3N1a3IJlT0Y6ytLpS0bQjPEqiw0IFE0HvBRjewQrwWMqUkcjUya2wNgvkkKigowUt2L1GJ9z3f24EXtnGfyhTu-hztN4r6_6Gbqijqpp1Umps27a_64vhJcvCw</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>METHOD FOR FABRICATING SEMICONDUCTOR DEVICE CHIPS AND PROTECTIVE COMPOSITION</title><source>esp@cenet</source><creator>SAKAKIBARA, Teru ; KARASAKI, Hidehiko ; KOMABIKI, Shinya ; MAEDA, Koji</creator><creatorcontrib>SAKAKIBARA, Teru ; KARASAKI, Hidehiko ; KOMABIKI, Shinya ; MAEDA, Koji</creatorcontrib><description>A protective composition contains a water-soluble polyester resin including a polyvalent carboxylic acid residue and a polyvalent alcohol residue. The polyvalent carboxylic acid residue includes: a polyvalent carboxylic acid residue having a metal sulfonate group; and a naphthalene dicarboxylic acid residue. The proportion of the polyvalent carboxylic acid residue to the polyvalent carboxylic acid residue falls within the range from 25 mol % to 70 mol %. The proportion of the naphthalene dicarboxylic acid residue to the polyvalent carboxylic acid residue falls within the range from 30 mol % to 75 mol %.</description><language>eng</language><subject>ADHESIVES ; BASIC ELECTRIC ELEMENTS ; CHEMICAL PAINT OR INK REMOVERS ; CHEMISTRY ; COATING COMPOSITIONS, e.g. PAINTS, VARNISHES ORLACQUERS ; COMPOSITIONS BASED THEREON ; CORRECTING FLUIDS ; DYES ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; FILLING PASTES ; INKS ; MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS ; METALLURGY ; MISCELLANEOUS APPLICATIONS OF MATERIALS ; MISCELLANEOUS COMPOSITIONS ; NATURAL RESINS ; ORGANIC MACROMOLECULAR COMPOUNDS ; PAINTS ; PASTES OR SOLIDS FOR COLOURING OR PRINTING ; POLISHES ; SEMICONDUCTOR DEVICES ; THEIR PREPARATION OR CHEMICAL WORKING-UP ; USE OF MATERIALS THEREFOR ; WOODSTAINS</subject><creationdate>2021</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20211021&amp;DB=EPODOC&amp;CC=US&amp;NR=2021324226A1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76289</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20211021&amp;DB=EPODOC&amp;CC=US&amp;NR=2021324226A1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>SAKAKIBARA, Teru</creatorcontrib><creatorcontrib>KARASAKI, Hidehiko</creatorcontrib><creatorcontrib>KOMABIKI, Shinya</creatorcontrib><creatorcontrib>MAEDA, Koji</creatorcontrib><title>METHOD FOR FABRICATING SEMICONDUCTOR DEVICE CHIPS AND PROTECTIVE COMPOSITION</title><description>A protective composition contains a water-soluble polyester resin including a polyvalent carboxylic acid residue and a polyvalent alcohol residue. The polyvalent carboxylic acid residue includes: a polyvalent carboxylic acid residue having a metal sulfonate group; and a naphthalene dicarboxylic acid residue. The proportion of the polyvalent carboxylic acid residue to the polyvalent carboxylic acid residue falls within the range from 25 mol % to 70 mol %. The proportion of the naphthalene dicarboxylic acid residue to the polyvalent carboxylic acid residue falls within the range from 30 mol % to 75 mol %.</description><subject>ADHESIVES</subject><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CHEMICAL PAINT OR INK REMOVERS</subject><subject>CHEMISTRY</subject><subject>COATING COMPOSITIONS, e.g. PAINTS, VARNISHES ORLACQUERS</subject><subject>COMPOSITIONS BASED THEREON</subject><subject>CORRECTING FLUIDS</subject><subject>DYES</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>FILLING PASTES</subject><subject>INKS</subject><subject>MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS</subject><subject>METALLURGY</subject><subject>MISCELLANEOUS APPLICATIONS OF MATERIALS</subject><subject>MISCELLANEOUS COMPOSITIONS</subject><subject>NATURAL RESINS</subject><subject>ORGANIC MACROMOLECULAR COMPOUNDS</subject><subject>PAINTS</subject><subject>PASTES OR SOLIDS FOR COLOURING OR PRINTING</subject><subject>POLISHES</subject><subject>SEMICONDUCTOR DEVICES</subject><subject>THEIR PREPARATION OR CHEMICAL WORKING-UP</subject><subject>USE OF MATERIALS THEREFOR</subject><subject>WOODSTAINS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2021</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNqNirEKwjAUALM4iPoPAWfBpuIeXxLzwOSF5LVrKRIn0UL9f-zgBzgd3N1a3IJlT0Y6ytLpS0bQjPEqiw0IFE0HvBRjewQrwWMqUkcjUya2wNgvkkKigowUt2L1GJ9z3f24EXtnGfyhTu-hztN4r6_6Gbqijqpp1Umps27a_64vhJcvCw</recordid><startdate>20211021</startdate><enddate>20211021</enddate><creator>SAKAKIBARA, Teru</creator><creator>KARASAKI, Hidehiko</creator><creator>KOMABIKI, Shinya</creator><creator>MAEDA, Koji</creator><scope>EVB</scope></search><sort><creationdate>20211021</creationdate><title>METHOD FOR FABRICATING SEMICONDUCTOR DEVICE CHIPS AND PROTECTIVE COMPOSITION</title><author>SAKAKIBARA, Teru ; KARASAKI, Hidehiko ; KOMABIKI, Shinya ; MAEDA, Koji</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_US2021324226A13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2021</creationdate><topic>ADHESIVES</topic><topic>BASIC ELECTRIC ELEMENTS</topic><topic>CHEMICAL PAINT OR INK REMOVERS</topic><topic>CHEMISTRY</topic><topic>COATING COMPOSITIONS, e.g. PAINTS, VARNISHES ORLACQUERS</topic><topic>COMPOSITIONS BASED THEREON</topic><topic>CORRECTING FLUIDS</topic><topic>DYES</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>FILLING PASTES</topic><topic>INKS</topic><topic>MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS</topic><topic>METALLURGY</topic><topic>MISCELLANEOUS APPLICATIONS OF MATERIALS</topic><topic>MISCELLANEOUS COMPOSITIONS</topic><topic>NATURAL RESINS</topic><topic>ORGANIC MACROMOLECULAR COMPOUNDS</topic><topic>PAINTS</topic><topic>PASTES OR SOLIDS FOR COLOURING OR PRINTING</topic><topic>POLISHES</topic><topic>SEMICONDUCTOR DEVICES</topic><topic>THEIR PREPARATION OR CHEMICAL WORKING-UP</topic><topic>USE OF MATERIALS THEREFOR</topic><topic>WOODSTAINS</topic><toplevel>online_resources</toplevel><creatorcontrib>SAKAKIBARA, Teru</creatorcontrib><creatorcontrib>KARASAKI, Hidehiko</creatorcontrib><creatorcontrib>KOMABIKI, Shinya</creatorcontrib><creatorcontrib>MAEDA, Koji</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>SAKAKIBARA, Teru</au><au>KARASAKI, Hidehiko</au><au>KOMABIKI, Shinya</au><au>MAEDA, Koji</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>METHOD FOR FABRICATING SEMICONDUCTOR DEVICE CHIPS AND PROTECTIVE COMPOSITION</title><date>2021-10-21</date><risdate>2021</risdate><abstract>A protective composition contains a water-soluble polyester resin including a polyvalent carboxylic acid residue and a polyvalent alcohol residue. The polyvalent carboxylic acid residue includes: a polyvalent carboxylic acid residue having a metal sulfonate group; and a naphthalene dicarboxylic acid residue. The proportion of the polyvalent carboxylic acid residue to the polyvalent carboxylic acid residue falls within the range from 25 mol % to 70 mol %. The proportion of the naphthalene dicarboxylic acid residue to the polyvalent carboxylic acid residue falls within the range from 30 mol % to 75 mol %.</abstract><oa>free_for_read</oa></addata></record>
fulltext fulltext_linktorsrc
identifier
ispartof
issn
language eng
recordid cdi_epo_espacenet_US2021324226A1
source esp@cenet
subjects ADHESIVES
BASIC ELECTRIC ELEMENTS
CHEMICAL PAINT OR INK REMOVERS
CHEMISTRY
COATING COMPOSITIONS, e.g. PAINTS, VARNISHES ORLACQUERS
COMPOSITIONS BASED THEREON
CORRECTING FLUIDS
DYES
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
FILLING PASTES
INKS
MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
METALLURGY
MISCELLANEOUS APPLICATIONS OF MATERIALS
MISCELLANEOUS COMPOSITIONS
NATURAL RESINS
ORGANIC MACROMOLECULAR COMPOUNDS
PAINTS
PASTES OR SOLIDS FOR COLOURING OR PRINTING
POLISHES
SEMICONDUCTOR DEVICES
THEIR PREPARATION OR CHEMICAL WORKING-UP
USE OF MATERIALS THEREFOR
WOODSTAINS
title METHOD FOR FABRICATING SEMICONDUCTOR DEVICE CHIPS AND PROTECTIVE COMPOSITION
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-02-06T01%3A07%3A57IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=SAKAKIBARA,%20Teru&rft.date=2021-10-21&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EUS2021324226A1%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true