Textured Bond Pads

Textured Bond Pads

In some examples, a package comprises a semiconductor die and a bond pad formed upon the semiconductor die. The bond pad has a protrusion on a top surface of the bond pad. The package also comprises a metal contact and a bond wire coupled to the protrusion and to the metal contact.

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: Guevara, Rafael Jose Lizares, Sanchez, Sylvester Tigno, Andaya, Alvin Lopez, de Asis, Ray Fredric Solis, Rabilas, JR., Aniceto Tabangcura
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
container_end_page
container_issue
container_start_page
container_title
container_volume
creator Guevara, Rafael Jose Lizares
Sanchez, Sylvester Tigno
Andaya, Alvin Lopez
de Asis, Ray Fredric Solis
Rabilas, JR., Aniceto Tabangcura
description In some examples, a package comprises a semiconductor die and a bond pad formed upon the semiconductor die. The bond pad has a protrusion on a top surface of the bond pad. The package also comprises a metal contact and a bond wire coupled to the protrusion and to the metal contact.
format Patent
fullrecord <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_US2021320074A1</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>US2021320074A1</sourcerecordid><originalsourceid>FETCH-epo_espacenet_US2021320074A13</originalsourceid><addsrcrecordid>eNrjZBAKSa0oKS1KTVFwys9LUQhITCnmYWBNS8wpTuWF0twMym6uIc4euqkF-fGpxQWJyal5qSXxocFGBkaGxkYGBuYmjobGxKkCAFRCIHc</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Textured Bond Pads</title><source>esp@cenet</source><creator>Guevara, Rafael Jose Lizares ; Sanchez, Sylvester Tigno ; Andaya, Alvin Lopez ; de Asis, Ray Fredric Solis ; Rabilas, JR., Aniceto Tabangcura</creator><creatorcontrib>Guevara, Rafael Jose Lizares ; Sanchez, Sylvester Tigno ; Andaya, Alvin Lopez ; de Asis, Ray Fredric Solis ; Rabilas, JR., Aniceto Tabangcura</creatorcontrib><description>In some examples, a package comprises a semiconductor die and a bond pad formed upon the semiconductor die. The bond pad has a protrusion on a top surface of the bond pad. The package also comprises a metal contact and a bond wire coupled to the protrusion and to the metal contact.</description><language>eng</language><subject>BASIC ELECTRIC ELEMENTS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; SEMICONDUCTOR DEVICES</subject><creationdate>2021</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20211014&amp;DB=EPODOC&amp;CC=US&amp;NR=2021320074A1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,777,882,25545,76296</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20211014&amp;DB=EPODOC&amp;CC=US&amp;NR=2021320074A1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>Guevara, Rafael Jose Lizares</creatorcontrib><creatorcontrib>Sanchez, Sylvester Tigno</creatorcontrib><creatorcontrib>Andaya, Alvin Lopez</creatorcontrib><creatorcontrib>de Asis, Ray Fredric Solis</creatorcontrib><creatorcontrib>Rabilas, JR., Aniceto Tabangcura</creatorcontrib><title>Textured Bond Pads</title><description>In some examples, a package comprises a semiconductor die and a bond pad formed upon the semiconductor die. The bond pad has a protrusion on a top surface of the bond pad. The package also comprises a metal contact and a bond wire coupled to the protrusion and to the metal contact.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2021</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZBAKSa0oKS1KTVFwys9LUQhITCnmYWBNS8wpTuWF0twMym6uIc4euqkF-fGpxQWJyal5qSXxocFGBkaGxkYGBuYmjobGxKkCAFRCIHc</recordid><startdate>20211014</startdate><enddate>20211014</enddate><creator>Guevara, Rafael Jose Lizares</creator><creator>Sanchez, Sylvester Tigno</creator><creator>Andaya, Alvin Lopez</creator><creator>de Asis, Ray Fredric Solis</creator><creator>Rabilas, JR., Aniceto Tabangcura</creator><scope>EVB</scope></search><sort><creationdate>20211014</creationdate><title>Textured Bond Pads</title><author>Guevara, Rafael Jose Lizares ; Sanchez, Sylvester Tigno ; Andaya, Alvin Lopez ; de Asis, Ray Fredric Solis ; Rabilas, JR., Aniceto Tabangcura</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_US2021320074A13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2021</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>Guevara, Rafael Jose Lizares</creatorcontrib><creatorcontrib>Sanchez, Sylvester Tigno</creatorcontrib><creatorcontrib>Andaya, Alvin Lopez</creatorcontrib><creatorcontrib>de Asis, Ray Fredric Solis</creatorcontrib><creatorcontrib>Rabilas, JR., Aniceto Tabangcura</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>Guevara, Rafael Jose Lizares</au><au>Sanchez, Sylvester Tigno</au><au>Andaya, Alvin Lopez</au><au>de Asis, Ray Fredric Solis</au><au>Rabilas, JR., Aniceto Tabangcura</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Textured Bond Pads</title><date>2021-10-14</date><risdate>2021</risdate><abstract>In some examples, a package comprises a semiconductor die and a bond pad formed upon the semiconductor die. The bond pad has a protrusion on a top surface of the bond pad. The package also comprises a metal contact and a bond wire coupled to the protrusion and to the metal contact.</abstract><oa>free_for_read</oa></addata></record>
fulltext fulltext_linktorsrc
identifier
ispartof
issn
language eng
recordid cdi_epo_espacenet_US2021320074A1
source esp@cenet
subjects BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
title Textured Bond Pads
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-19T16%3A19%3A58IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=Guevara,%20Rafael%20Jose%20Lizares&rft.date=2021-10-14&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EUS2021320074A1%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true