OBJECT PROCESSING APPARATUS

An object processing apparatus comprising a chamber that has an internal space able to be depressurized and is configured such that a target object is subjected to a plasma treatment in the internal space; a first electrode that is disposed in the chamber and on which the target object is to be mounted; a first power supply that applies a bias voltage of negative potential to the first electrode; a gas introduction device that introduces a processing gas into an inside of the chamber; and a pumping device that depressurizes the inside of the chamber. A cover is provided between the first electrode and the target object so as to cover the first electrode. A spacer is located between the first electrode and the cover, and is disposed so as to occupy a localized region.