INTERLAYER INSULATING MATERIAL AND MULTILAYER PRINTED WIRING BOARD

Provided is an interlayer insulating material that can enhance the adhesion between an insulating layer and a metal layer, and can reduce the surface roughness on a surface of the insulating layer. The present invention is an interlayer insulating material used for a multilayer printed wiring board,...

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Hauptverfasser: Nishimura, Takashi, Hayashi, Tatsushi, Baba, Susumu
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creator Nishimura, Takashi
Hayashi, Tatsushi
Baba, Susumu
description Provided is an interlayer insulating material that can enhance the adhesion between an insulating layer and a metal layer, and can reduce the surface roughness on a surface of the insulating layer. The present invention is an interlayer insulating material used for a multilayer printed wiring board, which contains an epoxy compound, a curing agent, a silica, and a polyimide, and in which the polymide is a reactant of a tetracarboxylic anhydride and a dimer acid diamine, a content of the silica is 30% by weight or more and 90% by weight or less in 100% by weight of components excluding a solvent in the interlayer insulating material, and the total content of the epoxy compound and the curing agent in 100% by weight of components excluding the silica and a solvent in the interlayer insulating material is 65% by weight or more.
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The present invention is an interlayer insulating material used for a multilayer printed wiring board, which contains an epoxy compound, a curing agent, a silica, and a polyimide, and in which the polymide is a reactant of a tetracarboxylic anhydride and a dimer acid diamine, a content of the silica is 30% by weight or more and 90% by weight or less in 100% by weight of components excluding a solvent in the interlayer insulating material, and the total content of the epoxy compound and the curing agent in 100% by weight of components excluding the silica and a solvent in the interlayer insulating material is 65% by weight or more.</description><language>eng</language><subject>AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G ; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; CHEMISTRY ; COMPOSITIONS BASED THEREON ; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; GENERAL PROCESSES OF COMPOUNDING ; LAYERED PRODUCTS ; LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; METALLURGY ; ORGANIC MACROMOLECULAR COMPOUNDS ; PERFORMING OPERATIONS ; PRINTED CIRCUITS ; THEIR PREPARATION OR CHEMICAL WORKING-UP ; TRANSPORTING ; WORKING-UP</subject><creationdate>2021</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20210916&amp;DB=EPODOC&amp;CC=US&amp;NR=2021284833A1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20210916&amp;DB=EPODOC&amp;CC=US&amp;NR=2021284833A1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>Nishimura, Takashi</creatorcontrib><creatorcontrib>Hayashi, Tatsushi</creatorcontrib><creatorcontrib>Baba, Susumu</creatorcontrib><title>INTERLAYER INSULATING MATERIAL AND MULTILAYER PRINTED WIRING BOARD</title><description>Provided is an interlayer insulating material that can enhance the adhesion between an insulating layer and a metal layer, and can reduce the surface roughness on a surface of the insulating layer. 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subjects AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
CHEMISTRY
COMPOSITIONS BASED THEREON
COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
GENERAL PROCESSES OF COMPOUNDING
LAYERED PRODUCTS
LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
METALLURGY
ORGANIC MACROMOLECULAR COMPOUNDS
PERFORMING OPERATIONS
PRINTED CIRCUITS
THEIR PREPARATION OR CHEMICAL WORKING-UP
TRANSPORTING
WORKING-UP
title INTERLAYER INSULATING MATERIAL AND MULTILAYER PRINTED WIRING BOARD
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