OPTICAL MODULE

An optical module includes: a board that is accommodated in a housing and in which a through hole is formed; a metal plate that is bonded to an area of the board including the through hole; a component that is mounted on one surface of the metal plate and is arranged inside the through hole; and a t...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: Ishizaka, Tetsuo, Ito, Tomoyuki, KUBO, TERUHIRO, OJIMA, YUKA
Format: Patent
Sprache:eng
Schlagworte:
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
container_end_page
container_issue
container_start_page
container_title
container_volume
creator Ishizaka, Tetsuo
Ito, Tomoyuki
KUBO, TERUHIRO
OJIMA, YUKA
description An optical module includes: a board that is accommodated in a housing and in which a through hole is formed; a metal plate that is bonded to an area of the board including the through hole; a component that is mounted on one surface of the metal plate and is arranged inside the through hole; and a thermal-conductive member that is arranged on another surface of the metal plate and transmits heat generated by the component to the housing.
format Patent
fullrecord <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_US2021278614A1</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>US2021278614A1</sourcerecordid><originalsourceid>FETCH-epo_espacenet_US2021278614A13</originalsourceid><addsrcrecordid>eNrjZODzDwjxdHb0UfD1dwn1ceVhYE1LzClO5YXS3AzKbq4hzh66qQX58anFBYnJqXmpJfGhwUYGRoZG5hZmhiaOhsbEqQIAOy8d3Q</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>OPTICAL MODULE</title><source>esp@cenet</source><creator>Ishizaka, Tetsuo ; Ito, Tomoyuki ; KUBO, TERUHIRO ; OJIMA, YUKA</creator><creatorcontrib>Ishizaka, Tetsuo ; Ito, Tomoyuki ; KUBO, TERUHIRO ; OJIMA, YUKA</creatorcontrib><description>An optical module includes: a board that is accommodated in a housing and in which a through hole is formed; a metal plate that is bonded to an area of the board including the through hole; a component that is mounted on one surface of the metal plate and is arranged inside the through hole; and a thermal-conductive member that is arranged on another surface of the metal plate and transmits heat generated by the component to the housing.</description><language>eng</language><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS ; OPTICS ; PHYSICS ; PRINTED CIRCUITS</subject><creationdate>2021</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20210909&amp;DB=EPODOC&amp;CC=US&amp;NR=2021278614A1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,309,781,886,25568,76551</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20210909&amp;DB=EPODOC&amp;CC=US&amp;NR=2021278614A1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>Ishizaka, Tetsuo</creatorcontrib><creatorcontrib>Ito, Tomoyuki</creatorcontrib><creatorcontrib>KUBO, TERUHIRO</creatorcontrib><creatorcontrib>OJIMA, YUKA</creatorcontrib><title>OPTICAL MODULE</title><description>An optical module includes: a board that is accommodated in a housing and in which a through hole is formed; a metal plate that is bonded to an area of the board including the through hole; a component that is mounted on one surface of the metal plate and is arranged inside the through hole; and a thermal-conductive member that is arranged on another surface of the metal plate and transmits heat generated by the component to the housing.</description><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS</subject><subject>OPTICS</subject><subject>PHYSICS</subject><subject>PRINTED CIRCUITS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2021</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZODzDwjxdHb0UfD1dwn1ceVhYE1LzClO5YXS3AzKbq4hzh66qQX58anFBYnJqXmpJfGhwUYGRoZG5hZmhiaOhsbEqQIAOy8d3Q</recordid><startdate>20210909</startdate><enddate>20210909</enddate><creator>Ishizaka, Tetsuo</creator><creator>Ito, Tomoyuki</creator><creator>KUBO, TERUHIRO</creator><creator>OJIMA, YUKA</creator><scope>EVB</scope></search><sort><creationdate>20210909</creationdate><title>OPTICAL MODULE</title><author>Ishizaka, Tetsuo ; Ito, Tomoyuki ; KUBO, TERUHIRO ; OJIMA, YUKA</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_US2021278614A13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2021</creationdate><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS</topic><topic>OPTICS</topic><topic>PHYSICS</topic><topic>PRINTED CIRCUITS</topic><toplevel>online_resources</toplevel><creatorcontrib>Ishizaka, Tetsuo</creatorcontrib><creatorcontrib>Ito, Tomoyuki</creatorcontrib><creatorcontrib>KUBO, TERUHIRO</creatorcontrib><creatorcontrib>OJIMA, YUKA</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>Ishizaka, Tetsuo</au><au>Ito, Tomoyuki</au><au>KUBO, TERUHIRO</au><au>OJIMA, YUKA</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>OPTICAL MODULE</title><date>2021-09-09</date><risdate>2021</risdate><abstract>An optical module includes: a board that is accommodated in a housing and in which a through hole is formed; a metal plate that is bonded to an area of the board including the through hole; a component that is mounted on one surface of the metal plate and is arranged inside the through hole; and a thermal-conductive member that is arranged on another surface of the metal plate and transmits heat generated by the component to the housing.</abstract><oa>free_for_read</oa></addata></record>
fulltext fulltext_linktorsrc
identifier
ispartof
issn
language eng
recordid cdi_epo_espacenet_US2021278614A1
source esp@cenet
subjects CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS
OPTICS
PHYSICS
PRINTED CIRCUITS
title OPTICAL MODULE
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2024-12-17T04%3A59%3A27IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=Ishizaka,%20Tetsuo&rft.date=2021-09-09&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EUS2021278614A1%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true