CHEMICAL DIRECT PATTERN PLATING METHOD

A semiconductor structure with an improved metal structure is described. The semiconductor structure can include a substrate having an upper surface, an interconnect layer over the upper surface, and an additional structure deposited over the interconnect layer. The interconnect layer can include a...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	Tsai, Ming-Hsing, Kao, Chen-Yuan, Su, Hung-Wen, Jang, Syun-Ming, LIU, Wen-Jiun
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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