SLURRY COMPOSITION FOR CHEMICAL MECHANICAL POLISHING
A slurry composition for chemical mechanical polishing (CMP) is provided. The slurry composition for CMP includes abrasive particles, an oxidizer, and a carbon polishing inhibitor.
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| creator | KONG, Hyun Goo HWANG, In Seol HWANG, Jin Sook |
| description | A slurry composition for chemical mechanical polishing (CMP) is provided. The slurry composition for CMP includes abrasive particles, an oxidizer, and a carbon polishing inhibitor. |
| format | Patent |
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| subjects | ADHESIVES CHEMISTRY DYES MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FORELSEWHERE METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS PAINTS POLISHES POLISHING COMPOSITIONS OTHER THAN FRENCH POLISH SKI WAXES |
| title | SLURRY COMPOSITION FOR CHEMICAL MECHANICAL POLISHING |
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