PARTICLE REMOVING ASSEMBLY AND METHOD OF SERVICING ASSEMBLY

An apparatus includes a wafer stage and a particle removing assembly. The wafer stage includes a cup adjacent to a wafer chuck. The particle removing assembly is configured to remove contaminant particles from the cup. In some embodiments, the particle removing assembly comprises a flexible ejecting...

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Bibliographische Detailangaben

Hauptverfasser:	LIU, Kai-Yu, KUO, Fang-Yu, CHEN, W.Y, WU, M.H, HUANG, Jao Sheng, WU, Yu-Chun
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CLEANING CLEANING IN GENERAL ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY PERFORMING OPERATIONS PREVENTION OF FOULING IN GENERAL SEMICONDUCTOR DEVICES TRANSPORTING
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