DUMMY WAFER
A dummy wafer includes a planar heater and a pair of plate-shaped members formed of an aluminum alloy, aluminum, or silicon carbide, wherein the planar heater is sandwiched by the plate-shaped members.
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creator | KOMIYA, Hiroaki KATO, Yoshiyasu NAKAYAMA, Hiroyuki KASAI, Shigeru AKAIKE, Yutaka |
description | A dummy wafer includes a planar heater and a pair of plate-shaped members formed of an aluminum alloy, aluminum, or silicon carbide, wherein the planar heater is sandwiched by the plate-shaped members. |
format | Patent |
fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_US2021265183A1</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>US2021265183A1</sourcerecordid><originalsourceid>FETCH-epo_espacenet_US2021265183A13</originalsourceid><addsrcrecordid>eNrjZOB2CfX1jVQId3RzDeJhYE1LzClO5YXS3AzKbq4hzh66qQX58anFBYnJqXmpJfGhwUYGRoZGZqaGFsaOhsbEqQIA4ugdAw</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>DUMMY WAFER</title><source>esp@cenet</source><creator>KOMIYA, Hiroaki ; KATO, Yoshiyasu ; NAKAYAMA, Hiroyuki ; KASAI, Shigeru ; AKAIKE, Yutaka</creator><creatorcontrib>KOMIYA, Hiroaki ; KATO, Yoshiyasu ; NAKAYAMA, Hiroyuki ; KASAI, Shigeru ; AKAIKE, Yutaka</creatorcontrib><description>A dummy wafer includes a planar heater and a pair of plate-shaped members formed of an aluminum alloy, aluminum, or silicon carbide, wherein the planar heater is sandwiched by the plate-shaped members.</description><language>eng</language><subject>BASIC ELECTRIC ELEMENTS ; ELECTRIC HEATING ; ELECTRIC LIGHTING NOT OTHERWISE PROVIDED FOR ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; LAYERED PRODUCTS ; LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM ; PERFORMING OPERATIONS ; SEMICONDUCTOR DEVICES ; TRANSPORTING</subject><creationdate>2021</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20210826&DB=EPODOC&CC=US&NR=2021265183A1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20210826&DB=EPODOC&CC=US&NR=2021265183A1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>KOMIYA, Hiroaki</creatorcontrib><creatorcontrib>KATO, Yoshiyasu</creatorcontrib><creatorcontrib>NAKAYAMA, Hiroyuki</creatorcontrib><creatorcontrib>KASAI, Shigeru</creatorcontrib><creatorcontrib>AKAIKE, Yutaka</creatorcontrib><title>DUMMY WAFER</title><description>A dummy wafer includes a planar heater and a pair of plate-shaped members formed of an aluminum alloy, aluminum, or silicon carbide, wherein the planar heater is sandwiched by the plate-shaped members.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>ELECTRIC HEATING</subject><subject>ELECTRIC LIGHTING NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>LAYERED PRODUCTS</subject><subject>LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM</subject><subject>PERFORMING OPERATIONS</subject><subject>SEMICONDUCTOR DEVICES</subject><subject>TRANSPORTING</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2021</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZOB2CfX1jVQId3RzDeJhYE1LzClO5YXS3AzKbq4hzh66qQX58anFBYnJqXmpJfGhwUYGRoZGZqaGFsaOhsbEqQIA4ugdAw</recordid><startdate>20210826</startdate><enddate>20210826</enddate><creator>KOMIYA, Hiroaki</creator><creator>KATO, Yoshiyasu</creator><creator>NAKAYAMA, Hiroyuki</creator><creator>KASAI, Shigeru</creator><creator>AKAIKE, Yutaka</creator><scope>EVB</scope></search><sort><creationdate>20210826</creationdate><title>DUMMY WAFER</title><author>KOMIYA, Hiroaki ; KATO, Yoshiyasu ; NAKAYAMA, Hiroyuki ; KASAI, Shigeru ; AKAIKE, Yutaka</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_US2021265183A13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2021</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>ELECTRIC HEATING</topic><topic>ELECTRIC LIGHTING NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>LAYERED PRODUCTS</topic><topic>LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM</topic><topic>PERFORMING OPERATIONS</topic><topic>SEMICONDUCTOR DEVICES</topic><topic>TRANSPORTING</topic><toplevel>online_resources</toplevel><creatorcontrib>KOMIYA, Hiroaki</creatorcontrib><creatorcontrib>KATO, Yoshiyasu</creatorcontrib><creatorcontrib>NAKAYAMA, Hiroyuki</creatorcontrib><creatorcontrib>KASAI, Shigeru</creatorcontrib><creatorcontrib>AKAIKE, Yutaka</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>KOMIYA, Hiroaki</au><au>KATO, Yoshiyasu</au><au>NAKAYAMA, Hiroyuki</au><au>KASAI, Shigeru</au><au>AKAIKE, Yutaka</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>DUMMY WAFER</title><date>2021-08-26</date><risdate>2021</risdate><abstract>A dummy wafer includes a planar heater and a pair of plate-shaped members formed of an aluminum alloy, aluminum, or silicon carbide, wherein the planar heater is sandwiched by the plate-shaped members.</abstract><oa>free_for_read</oa></addata></record> |
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subjects | BASIC ELECTRIC ELEMENTS ELECTRIC HEATING ELECTRIC LIGHTING NOT OTHERWISE PROVIDED FOR ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM PERFORMING OPERATIONS SEMICONDUCTOR DEVICES TRANSPORTING |
title | DUMMY WAFER |
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