SEMICONDUCTOR PACKAGE

A semiconductor package provided. The semiconductor package includes an interposer layer including a first surface and a second surface opposing each other, a first semiconductor chip and a second semiconductor chip on the first surface of the interposer layer, and a block copolymer film on the firs...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	PARK, Soo Jeoung, IM, Yun Hyeok
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
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