SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE

A semiconductor package provided. The semiconductor package includes an interposer layer including a first surface and a second surface opposing each other, a first semiconductor chip and a second semiconductor chip on the first surface of the interposer layer, and a block copolymer film on the firs...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: PARK, Soo Jeoung, IM, Yun Hyeok
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
Beschreibung
Zusammenfassung:A semiconductor package provided. The semiconductor package includes an interposer layer including a first surface and a second surface opposing each other, a first semiconductor chip and a second semiconductor chip on the first surface of the interposer layer, and a block copolymer film on the first semiconductor chip and the second semiconductor chip. The first semiconductor chip and the second semiconductor chip are different from each other. The block copolymer film includes a first pattern and a second pattern, which are different from each other, and one of the first pattern and the second pattern contains graphite.