ULTRA THIN DIELECTRIC PRINTED CIRCUIT BOARDS WITH THIN LAMINATES AND METHOD OF MANUFACTURING THEREOF

Ultra-thin dielectric printed circuit boards (PCBs) are provided. An ultra-thin dielectric layer may be coupled to a first conductive layer on a first side of the ultra-thin dielectric layer. A second conductive layer may be coupled to a second side of the ultra-thin dielectric layer, and the ultra-...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	Suzuki, Toshiya, Iketani, Shinichi
Format:	Patent
Sprache:	eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
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