SYSTEM AND METHOD FOR ENHANCED COOLING

An electronic device includes a packaged device and a thermal dissipater. The packaged device includes a component that generates thermal energy, a package that encapsulates the component, and an interconnect that forms a portion of a high thermal conduction between the component and a circuit card....

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	Petivan, James L, Chin, Jordan H, Spencer, Tim M, Curtis, Robert Boyd, Wang, Isaac Q
Format:	Patent
Sprache:	eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
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