INTEGRATED CIRCUIT ASSEMBLIES HAVING METAL FOAM STRUCTURES
An integrated circuit assembly may be formed comprising an electronic substrate, at least one integrated circuit device electrically attached to the electronic substrate, a heat dissipation device, a thermal interface material between the at least one integrated circuit device and the heat dissipati...
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| creator | Uppal, Aastha Chang, Je-Young |
| description | An integrated circuit assembly may be formed comprising an electronic substrate, at least one integrated circuit device electrically attached to the electronic substrate, a heat dissipation device, a thermal interface material between the at least one integrated circuit device and the heat dissipation device, and a metal foam surrounding the at least one integrated circuit device and contacting the thermal interface material. The integrated circuit assembly may further include a stiffener attached to the electronic substrate and surrounding the at least one integrated circuit device, wherein the metal foam is disposed between the stiffener, the at least one integrated circuit device, the electronic substrate, and the heat dissipation device. |
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| fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_US2021233832A1</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>US2021233832A1</sourcerecordid><originalsourceid>FETCH-epo_espacenet_US2021233832A13</originalsourceid><addsrcrecordid>eNrjZLDy9AtxdQ9yDHF1UXD2DHIO9QxRcAwOdvV18vF0DVbwcAzz9HNX8HUNcfRRcPN39FUIDgkKdQ4JDXIN5mFgTUvMKU7lhdLcDMpuriHOHrqpBfnxqcUFicmpeakl8aHBRgZGhkbGxhbGRo6GxsSpAgBwbioi</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>INTEGRATED CIRCUIT ASSEMBLIES HAVING METAL FOAM STRUCTURES</title><source>esp@cenet</source><creator>Uppal, Aastha ; Chang, Je-Young</creator><creatorcontrib>Uppal, Aastha ; Chang, Je-Young</creatorcontrib><description>An integrated circuit assembly may be formed comprising an electronic substrate, at least one integrated circuit device electrically attached to the electronic substrate, a heat dissipation device, a thermal interface material between the at least one integrated circuit device and the heat dissipation device, and a metal foam surrounding the at least one integrated circuit device and contacting the thermal interface material. The integrated circuit assembly may further include a stiffener attached to the electronic substrate and surrounding the at least one integrated circuit device, wherein the metal foam is disposed between the stiffener, the at least one integrated circuit device, the electronic substrate, and the heat dissipation device.</description><language>eng</language><subject>BASIC ELECTRIC ELEMENTS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; SEMICONDUCTOR DEVICES</subject><creationdate>2021</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20210729&DB=EPODOC&CC=US&NR=2021233832A1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20210729&DB=EPODOC&CC=US&NR=2021233832A1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>Uppal, Aastha</creatorcontrib><creatorcontrib>Chang, Je-Young</creatorcontrib><title>INTEGRATED CIRCUIT ASSEMBLIES HAVING METAL FOAM STRUCTURES</title><description>An integrated circuit assembly may be formed comprising an electronic substrate, at least one integrated circuit device electrically attached to the electronic substrate, a heat dissipation device, a thermal interface material between the at least one integrated circuit device and the heat dissipation device, and a metal foam surrounding the at least one integrated circuit device and contacting the thermal interface material. The integrated circuit assembly may further include a stiffener attached to the electronic substrate and surrounding the at least one integrated circuit device, wherein the metal foam is disposed between the stiffener, the at least one integrated circuit device, the electronic substrate, and the heat dissipation device.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2021</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZLDy9AtxdQ9yDHF1UXD2DHIO9QxRcAwOdvV18vF0DVbwcAzz9HNX8HUNcfRRcPN39FUIDgkKdQ4JDXIN5mFgTUvMKU7lhdLcDMpuriHOHrqpBfnxqcUFicmpeakl8aHBRgZGhkbGxhbGRo6GxsSpAgBwbioi</recordid><startdate>20210729</startdate><enddate>20210729</enddate><creator>Uppal, Aastha</creator><creator>Chang, Je-Young</creator><scope>EVB</scope></search><sort><creationdate>20210729</creationdate><title>INTEGRATED CIRCUIT ASSEMBLIES HAVING METAL FOAM STRUCTURES</title><author>Uppal, Aastha ; Chang, Je-Young</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_US2021233832A13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2021</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>Uppal, Aastha</creatorcontrib><creatorcontrib>Chang, Je-Young</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>Uppal, Aastha</au><au>Chang, Je-Young</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>INTEGRATED CIRCUIT ASSEMBLIES HAVING METAL FOAM STRUCTURES</title><date>2021-07-29</date><risdate>2021</risdate><abstract>An integrated circuit assembly may be formed comprising an electronic substrate, at least one integrated circuit device electrically attached to the electronic substrate, a heat dissipation device, a thermal interface material between the at least one integrated circuit device and the heat dissipation device, and a metal foam surrounding the at least one integrated circuit device and contacting the thermal interface material. The integrated circuit assembly may further include a stiffener attached to the electronic substrate and surrounding the at least one integrated circuit device, wherein the metal foam is disposed between the stiffener, the at least one integrated circuit device, the electronic substrate, and the heat dissipation device.</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES |
| title | INTEGRATED CIRCUIT ASSEMBLIES HAVING METAL FOAM STRUCTURES |
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