HEAT DISSIPATION PLATE FOR CHIP HEAT DISSIPATION, SERVER HEAT DISSIPATION SYSTEM, AND HEATING DEVICE

The present disclosure discloses a heat dissipation plate for chip heat dissipation, a server heat dissipation system, and a heating device. One end of the heat dissipation plate may be blocked. Another end of the heat dissipation plate may be provided with a water inlet and a water outlet. A pipeli...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	LIU, Yunfeng, WANG, Liedong, LI, Risheng
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!