HEAT SPREADERS FOR SEMICONDUCTOR DEVICES, AND ASSOCIATED SYSTEMS AND METHODS

A memory system having heat spreaders with different arrangements of projections are provided. In some embodiments, the memory system comprises a substrate, a first semiconductor device attached to a first side of the substrate, a second semiconductor device attached to a second side of the substrat...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: Qu, Xiaopeng, Chun, Hyunsuk, Griffin, Amy R
Format: Patent
Sprache:eng
Schlagworte:
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