MEMORY DIE INCLUDING LOCAL PROCESSOR AND GLOBAL PROCESSOR, MEMORY DEVICE, AND ELECTRONIC DEVICE

A memory die includes a first bank including first memory cells; a second bank including second memory cells; a first local processor connected with first bank local input/output lines through which first local bank data of the first bank are transmitted, and configured to execute a first local calculation on the first local bank data; a second local processor connected with second bank local input/output lines through which second local bank data of the second bank are transmitted, and configured to execute a second local calculation on the second local bank data; and a global processor configured to control the first bank, the second bank, the first local processor, and the second local processor and to execute a global calculation on a first local calculation result of the first local calculation and a second local calculation result of the second local calculation.