SHOWERHEAD ASSEMBLY AND COMPONENTS
The present disclosure pertains to embodiments of a showerhead assembly which can be used to deposit semiconductor layers using processes such as atomic layer deposition (ALD). The showerhead assembly has a showerhead which has an increased thickness which advantageously decreases reactor chamber si...
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creator | Schmotzer, Michael Olstad, Mark Shero, Eric James Terhorst, Herbert Nandwana, Dinkar Winkler, Jereld Lee White, Carl Louis Fondurulia, Kyle Kimtee, Ankit Petro, William George Trivedi, Gnyanesh |
description | The present disclosure pertains to embodiments of a showerhead assembly which can be used to deposit semiconductor layers using processes such as atomic layer deposition (ALD). The showerhead assembly has a showerhead which has an increased thickness which advantageously decreases reactor chamber size and decreases cycling time. Decreased cycling time can improve throughput and decrease costs. |
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The showerhead assembly has a showerhead which has an increased thickness which advantageously decreases reactor chamber size and decreases cycling time. Decreased cycling time can improve throughput and decrease costs.</description><language>eng</language><subject>CHEMICAL SURFACE TREATMENT ; CHEMISTRY ; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL ; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL ; COATING MATERIAL WITH METALLIC MATERIAL ; COATING METALLIC MATERIAL ; DIFFUSION TREATMENT OF METALLIC MATERIAL ; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL ; METALLURGY ; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION</subject><creationdate>2021</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20210715&DB=EPODOC&CC=US&NR=2021214846A1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76419</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20210715&DB=EPODOC&CC=US&NR=2021214846A1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>Schmotzer, Michael</creatorcontrib><creatorcontrib>Olstad, Mark</creatorcontrib><creatorcontrib>Shero, Eric James</creatorcontrib><creatorcontrib>Terhorst, Herbert</creatorcontrib><creatorcontrib>Nandwana, Dinkar</creatorcontrib><creatorcontrib>Winkler, Jereld Lee</creatorcontrib><creatorcontrib>White, Carl Louis</creatorcontrib><creatorcontrib>Fondurulia, Kyle</creatorcontrib><creatorcontrib>Kimtee, Ankit</creatorcontrib><creatorcontrib>Petro, William George</creatorcontrib><creatorcontrib>Trivedi, Gnyanesh</creatorcontrib><title>SHOWERHEAD ASSEMBLY AND COMPONENTS</title><description>The present disclosure pertains to embodiments of a showerhead assembly which can be used to deposit semiconductor layers using processes such as atomic layer deposition (ALD). The showerhead assembly has a showerhead which has an increased thickness which advantageously decreases reactor chamber size and decreases cycling time. Decreased cycling time can improve throughput and decrease costs.</description><subject>CHEMICAL SURFACE TREATMENT</subject><subject>CHEMISTRY</subject><subject>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</subject><subject>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</subject><subject>COATING MATERIAL WITH METALLIC MATERIAL</subject><subject>COATING METALLIC MATERIAL</subject><subject>DIFFUSION TREATMENT OF METALLIC MATERIAL</subject><subject>INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL</subject><subject>METALLURGY</subject><subject>SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2021</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZFAK9vAPdw3ycHV0UXAMDnb1dfKJVHD0c1Fw9vcN8Pdz9QsJ5mFgTUvMKU7lhdLcDMpuriHOHrqpBfnxqcUFicmpeakl8aHBRgZGhkaGJhYmZo6GxsSpAgDOeSN8</recordid><startdate>20210715</startdate><enddate>20210715</enddate><creator>Schmotzer, Michael</creator><creator>Olstad, Mark</creator><creator>Shero, Eric James</creator><creator>Terhorst, Herbert</creator><creator>Nandwana, Dinkar</creator><creator>Winkler, Jereld Lee</creator><creator>White, Carl Louis</creator><creator>Fondurulia, Kyle</creator><creator>Kimtee, Ankit</creator><creator>Petro, William George</creator><creator>Trivedi, Gnyanesh</creator><scope>EVB</scope></search><sort><creationdate>20210715</creationdate><title>SHOWERHEAD ASSEMBLY AND COMPONENTS</title><author>Schmotzer, Michael ; Olstad, Mark ; Shero, Eric James ; Terhorst, Herbert ; Nandwana, Dinkar ; Winkler, Jereld Lee ; White, Carl Louis ; Fondurulia, Kyle ; Kimtee, Ankit ; Petro, William George ; Trivedi, Gnyanesh</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_US2021214846A13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2021</creationdate><topic>CHEMICAL SURFACE TREATMENT</topic><topic>CHEMISTRY</topic><topic>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</topic><topic>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</topic><topic>COATING MATERIAL WITH METALLIC MATERIAL</topic><topic>COATING METALLIC MATERIAL</topic><topic>DIFFUSION TREATMENT OF METALLIC MATERIAL</topic><topic>INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL</topic><topic>METALLURGY</topic><topic>SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION</topic><toplevel>online_resources</toplevel><creatorcontrib>Schmotzer, Michael</creatorcontrib><creatorcontrib>Olstad, Mark</creatorcontrib><creatorcontrib>Shero, Eric James</creatorcontrib><creatorcontrib>Terhorst, Herbert</creatorcontrib><creatorcontrib>Nandwana, Dinkar</creatorcontrib><creatorcontrib>Winkler, Jereld Lee</creatorcontrib><creatorcontrib>White, Carl Louis</creatorcontrib><creatorcontrib>Fondurulia, Kyle</creatorcontrib><creatorcontrib>Kimtee, Ankit</creatorcontrib><creatorcontrib>Petro, William George</creatorcontrib><creatorcontrib>Trivedi, Gnyanesh</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>Schmotzer, Michael</au><au>Olstad, Mark</au><au>Shero, Eric James</au><au>Terhorst, Herbert</au><au>Nandwana, Dinkar</au><au>Winkler, Jereld Lee</au><au>White, Carl Louis</au><au>Fondurulia, Kyle</au><au>Kimtee, Ankit</au><au>Petro, William George</au><au>Trivedi, Gnyanesh</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>SHOWERHEAD ASSEMBLY AND COMPONENTS</title><date>2021-07-15</date><risdate>2021</risdate><abstract>The present disclosure pertains to embodiments of a showerhead assembly which can be used to deposit semiconductor layers using processes such as atomic layer deposition (ALD). The showerhead assembly has a showerhead which has an increased thickness which advantageously decreases reactor chamber size and decreases cycling time. Decreased cycling time can improve throughput and decrease costs.</abstract><oa>free_for_read</oa></addata></record> |
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subjects | CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION |
title | SHOWERHEAD ASSEMBLY AND COMPONENTS |
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