SHOWERHEAD ASSEMBLY AND COMPONENTS

The present disclosure pertains to embodiments of a showerhead assembly which can be used to deposit semiconductor layers using processes such as atomic layer deposition (ALD). The showerhead assembly has a showerhead which has an increased thickness which advantageously decreases reactor chamber si...

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Hauptverfasser: Schmotzer, Michael, Olstad, Mark, Shero, Eric James, Terhorst, Herbert, Nandwana, Dinkar, Winkler, Jereld Lee, White, Carl Louis, Fondurulia, Kyle, Kimtee, Ankit, Petro, William George, Trivedi, Gnyanesh
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creator Schmotzer, Michael
Olstad, Mark
Shero, Eric James
Terhorst, Herbert
Nandwana, Dinkar
Winkler, Jereld Lee
White, Carl Louis
Fondurulia, Kyle
Kimtee, Ankit
Petro, William George
Trivedi, Gnyanesh
description The present disclosure pertains to embodiments of a showerhead assembly which can be used to deposit semiconductor layers using processes such as atomic layer deposition (ALD). The showerhead assembly has a showerhead which has an increased thickness which advantageously decreases reactor chamber size and decreases cycling time. Decreased cycling time can improve throughput and decrease costs.
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subjects CHEMICAL SURFACE TREATMENT
CHEMISTRY
COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
COATING MATERIAL WITH METALLIC MATERIAL
COATING METALLIC MATERIAL
DIFFUSION TREATMENT OF METALLIC MATERIAL
INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL
METALLURGY
SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION
title SHOWERHEAD ASSEMBLY AND COMPONENTS
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