SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

A semiconductor package includes a substrate, a plurality of semiconductor devices stacked on the substrate, a plurality of underfill fillets disposed between the plurality of semiconductor devices and between the substrate and the plurality of semiconductor devices, and molding resin surrounding th...

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Hauptverfasser:	KANG, HYEONGMUN, KO, JUNGMIN, SHIN, INSUP, KIM, TAEHYEONG, BAEK, SEUNGDUK
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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creator	KANG, HYEONGMUN KO, JUNGMIN SHIN, INSUP KIM, TAEHYEONG BAEK, SEUNGDUK
description	A semiconductor package includes a substrate, a plurality of semiconductor devices stacked on the substrate, a plurality of underfill fillets disposed between the plurality of semiconductor devices and between the substrate and the plurality of semiconductor devices, and molding resin surrounding the plurality of semiconductor devices. At least one of the underfill fillets is exposed from side surfaces of the molding resin.
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subjects	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
title	SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
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