SILICONE COMPOSITE FOR HIGH TEMPERATURE APPLICATIONS
A silicone composite for high temperature insulation applications is disclosed. The composite is formed of a silicone and a thermally decomposable inorganic filler which are compounded together. The compounded material is then injection molded, overmolded, compression molded, cast, laminated, extrud...
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creator | WANG, Lei WU, Yiliang DONG, Mei GAO, Ting WOLF, Marco TAO, Dejie DRESSEL, Andre Martin |
description | A silicone composite for high temperature insulation applications is disclosed. The composite is formed of a silicone and a thermally decomposable inorganic filler which are compounded together. The compounded material is then injection molded, overmolded, compression molded, cast, laminated, extruded, or dispensed. When the silicone composite is exposed to a high temperature, it forms an inorganic composite and maintains its insulating properties and dimensional stability. |
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fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_US2021206971A1</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>US2021206971A1</sourcerecordid><originalsourceid>FETCH-epo_espacenet_US2021206971A13</originalsourceid><addsrcrecordid>eNrjZDAJ9vTxdPb3c1Vw9vcN8A_2DHFVcPMPUvDwdPdQCHH1DXANcgwJDXJVcAwIACp0DPH09wvmYWBNS8wpTuWF0twMym6uIc4euqkF-fGpxQWJyal5qSXxocFGBkaGRgZmluaGjobGxKkCAIDHKJA</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>SILICONE COMPOSITE FOR HIGH TEMPERATURE APPLICATIONS</title><source>esp@cenet</source><creator>WANG, Lei ; WU, Yiliang ; DONG, Mei ; GAO, Ting ; WOLF, Marco ; TAO, Dejie ; DRESSEL, Andre Martin</creator><creatorcontrib>WANG, Lei ; WU, Yiliang ; DONG, Mei ; GAO, Ting ; WOLF, Marco ; TAO, Dejie ; DRESSEL, Andre Martin</creatorcontrib><description>A silicone composite for high temperature insulation applications is disclosed. The composite is formed of a silicone and a thermally decomposable inorganic filler which are compounded together. The compounded material is then injection molded, overmolded, compression molded, cast, laminated, extruded, or dispensed. When the silicone composite is exposed to a high temperature, it forms an inorganic composite and maintains its insulating properties and dimensional stability.</description><language>eng</language><subject>CHEMISTRY ; COMPOSITIONS BASED THEREON ; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS ; LAYERED PRODUCTS ; LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM ; METALLURGY ; ORGANIC MACROMOLECULAR COMPOUNDS ; PERFORMING OPERATIONS ; THEIR PREPARATION OR CHEMICAL WORKING-UP ; TRANSPORTING</subject><creationdate>2021</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20210708&DB=EPODOC&CC=US&NR=2021206971A1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76290</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20210708&DB=EPODOC&CC=US&NR=2021206971A1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>WANG, Lei</creatorcontrib><creatorcontrib>WU, Yiliang</creatorcontrib><creatorcontrib>DONG, Mei</creatorcontrib><creatorcontrib>GAO, Ting</creatorcontrib><creatorcontrib>WOLF, Marco</creatorcontrib><creatorcontrib>TAO, Dejie</creatorcontrib><creatorcontrib>DRESSEL, Andre Martin</creatorcontrib><title>SILICONE COMPOSITE FOR HIGH TEMPERATURE APPLICATIONS</title><description>A silicone composite for high temperature insulation applications is disclosed. The composite is formed of a silicone and a thermally decomposable inorganic filler which are compounded together. The compounded material is then injection molded, overmolded, compression molded, cast, laminated, extruded, or dispensed. When the silicone composite is exposed to a high temperature, it forms an inorganic composite and maintains its insulating properties and dimensional stability.</description><subject>CHEMISTRY</subject><subject>COMPOSITIONS BASED THEREON</subject><subject>COMPOSITIONS OF MACROMOLECULAR COMPOUNDS</subject><subject>LAYERED PRODUCTS</subject><subject>LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM</subject><subject>METALLURGY</subject><subject>ORGANIC MACROMOLECULAR COMPOUNDS</subject><subject>PERFORMING OPERATIONS</subject><subject>THEIR PREPARATION OR CHEMICAL WORKING-UP</subject><subject>TRANSPORTING</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2021</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZDAJ9vTxdPb3c1Vw9vcN8A_2DHFVcPMPUvDwdPdQCHH1DXANcgwJDXJVcAwIACp0DPH09wvmYWBNS8wpTuWF0twMym6uIc4euqkF-fGpxQWJyal5qSXxocFGBkaGRgZmluaGjobGxKkCAIDHKJA</recordid><startdate>20210708</startdate><enddate>20210708</enddate><creator>WANG, Lei</creator><creator>WU, Yiliang</creator><creator>DONG, Mei</creator><creator>GAO, Ting</creator><creator>WOLF, Marco</creator><creator>TAO, Dejie</creator><creator>DRESSEL, Andre Martin</creator><scope>EVB</scope></search><sort><creationdate>20210708</creationdate><title>SILICONE COMPOSITE FOR HIGH TEMPERATURE APPLICATIONS</title><author>WANG, Lei ; WU, Yiliang ; DONG, Mei ; GAO, Ting ; WOLF, Marco ; TAO, Dejie ; DRESSEL, Andre Martin</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_US2021206971A13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2021</creationdate><topic>CHEMISTRY</topic><topic>COMPOSITIONS BASED THEREON</topic><topic>COMPOSITIONS OF MACROMOLECULAR COMPOUNDS</topic><topic>LAYERED PRODUCTS</topic><topic>LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM</topic><topic>METALLURGY</topic><topic>ORGANIC MACROMOLECULAR COMPOUNDS</topic><topic>PERFORMING OPERATIONS</topic><topic>THEIR PREPARATION OR CHEMICAL WORKING-UP</topic><topic>TRANSPORTING</topic><toplevel>online_resources</toplevel><creatorcontrib>WANG, Lei</creatorcontrib><creatorcontrib>WU, Yiliang</creatorcontrib><creatorcontrib>DONG, Mei</creatorcontrib><creatorcontrib>GAO, Ting</creatorcontrib><creatorcontrib>WOLF, Marco</creatorcontrib><creatorcontrib>TAO, Dejie</creatorcontrib><creatorcontrib>DRESSEL, Andre Martin</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>WANG, Lei</au><au>WU, Yiliang</au><au>DONG, Mei</au><au>GAO, Ting</au><au>WOLF, Marco</au><au>TAO, Dejie</au><au>DRESSEL, Andre Martin</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>SILICONE COMPOSITE FOR HIGH TEMPERATURE APPLICATIONS</title><date>2021-07-08</date><risdate>2021</risdate><abstract>A silicone composite for high temperature insulation applications is disclosed. The composite is formed of a silicone and a thermally decomposable inorganic filler which are compounded together. The compounded material is then injection molded, overmolded, compression molded, cast, laminated, extruded, or dispensed. When the silicone composite is exposed to a high temperature, it forms an inorganic composite and maintains its insulating properties and dimensional stability.</abstract><oa>free_for_read</oa></addata></record> |
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subjects | CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS PERFORMING OPERATIONS THEIR PREPARATION OR CHEMICAL WORKING-UP TRANSPORTING |
title | SILICONE COMPOSITE FOR HIGH TEMPERATURE APPLICATIONS |
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