PLASMA PROCESSING METHOD, AND ELEMENT CHIP MANUFACTURING METHOD

A plasma processing method, including: a trenched substrate preparation process of preparing a trenched substrate having trenches having a bottom exposing an oxide film; and an oxide film removal process of exposing the trenched substrate to a plasma, to remove the oxide film. The oxide film removal...

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Bibliographische Detailangaben
Hauptverfasser: HARIKAI, Atsushi, OKITA, Shogo
Format: Patent
Sprache:eng
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