THERMOPILE MODULE

An electronic device includes an outer case, a circuit substrate, a thermopile sensor chip, a filter structure, and a waterproof structure. The outer case has an opening. The circuit substrate is disposed inside the outer case. The thermopile sensor chip is disposed on the circuit substrate. The fil...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: TSAI, MING-HAN, LIAO, JIANNG, SUN, CHIH-MING
Format: Patent
Sprache:eng
Schlagworte:
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