SUBSTRATE HAVING ELECTRONIC COMPONENT EMBEDDED THEREIN

A substrate having an electronic component embedded therein includes a core structure including a first insulating body and first wiring layers and having a cavity, an electronic component embedded in the cavity, a build-up structure including a second insulating body, covering at least a portion of...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: Byun, Dae Jung, Lee, Yong Duk, Park, Chang Hwa, Lee, Jin Won, Na, Ki Ho, Park, Je Sang
Format: Patent
Sprache:eng
Schlagworte:
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
container_end_page
container_issue
container_start_page
container_title
container_volume
creator Byun, Dae Jung
Lee, Yong Duk
Park, Chang Hwa
Lee, Jin Won
Na, Ki Ho
Park, Je Sang
description A substrate having an electronic component embedded therein includes a core structure including a first insulating body and first wiring layers and having a cavity, an electronic component embedded in the cavity, a build-up structure including a second insulating body, covering at least a portion of each of the core structure and the electronic component and filling a portion of the cavity, and second wiring layers, a first passivation layer disposed on a side of the core structure opposing a side of the core structure on which the build-up structure is disposed, and a second passivation layer disposed on a side of the build-up structure opposing a side of the build-up structure on which the core structure is disposed, wherein the first and second passivation layers include different types of materials.
format Patent
fullrecord <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_US2021193563A1</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>US2021193563A1</sourcerecordid><originalsourceid>FETCH-epo_espacenet_US2021193563A13</originalsourceid><addsrcrecordid>eNrjZDALDnUKDglyDHFV8HAM8_RzV3D1cXUOCfL383RWcPb3DfD3c_ULUXD1dXJ1cXF1UQjxcA1y9fTjYWBNS8wpTuWF0twMym6uIc4euqkF-fGpxQWJyal5qSXxocFGBkaGhpbGpmbGjobGxKkCAMnDKP8</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>SUBSTRATE HAVING ELECTRONIC COMPONENT EMBEDDED THEREIN</title><source>esp@cenet</source><creator>Byun, Dae Jung ; Lee, Yong Duk ; Park, Chang Hwa ; Lee, Jin Won ; Na, Ki Ho ; Park, Je Sang</creator><creatorcontrib>Byun, Dae Jung ; Lee, Yong Duk ; Park, Chang Hwa ; Lee, Jin Won ; Na, Ki Ho ; Park, Je Sang</creatorcontrib><description>A substrate having an electronic component embedded therein includes a core structure including a first insulating body and first wiring layers and having a cavity, an electronic component embedded in the cavity, a build-up structure including a second insulating body, covering at least a portion of each of the core structure and the electronic component and filling a portion of the cavity, and second wiring layers, a first passivation layer disposed on a side of the core structure opposing a side of the core structure on which the build-up structure is disposed, and a second passivation layer disposed on a side of the build-up structure opposing a side of the build-up structure on which the core structure is disposed, wherein the first and second passivation layers include different types of materials.</description><language>eng</language><subject>BASIC ELECTRIC ELEMENTS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; SEMICONDUCTOR DEVICES</subject><creationdate>2021</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20210624&amp;DB=EPODOC&amp;CC=US&amp;NR=2021193563A1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25563,76418</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20210624&amp;DB=EPODOC&amp;CC=US&amp;NR=2021193563A1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>Byun, Dae Jung</creatorcontrib><creatorcontrib>Lee, Yong Duk</creatorcontrib><creatorcontrib>Park, Chang Hwa</creatorcontrib><creatorcontrib>Lee, Jin Won</creatorcontrib><creatorcontrib>Na, Ki Ho</creatorcontrib><creatorcontrib>Park, Je Sang</creatorcontrib><title>SUBSTRATE HAVING ELECTRONIC COMPONENT EMBEDDED THEREIN</title><description>A substrate having an electronic component embedded therein includes a core structure including a first insulating body and first wiring layers and having a cavity, an electronic component embedded in the cavity, a build-up structure including a second insulating body, covering at least a portion of each of the core structure and the electronic component and filling a portion of the cavity, and second wiring layers, a first passivation layer disposed on a side of the core structure opposing a side of the core structure on which the build-up structure is disposed, and a second passivation layer disposed on a side of the build-up structure opposing a side of the build-up structure on which the core structure is disposed, wherein the first and second passivation layers include different types of materials.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2021</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZDALDnUKDglyDHFV8HAM8_RzV3D1cXUOCfL383RWcPb3DfD3c_ULUXD1dXJ1cXF1UQjxcA1y9fTjYWBNS8wpTuWF0twMym6uIc4euqkF-fGpxQWJyal5qSXxocFGBkaGhpbGpmbGjobGxKkCAMnDKP8</recordid><startdate>20210624</startdate><enddate>20210624</enddate><creator>Byun, Dae Jung</creator><creator>Lee, Yong Duk</creator><creator>Park, Chang Hwa</creator><creator>Lee, Jin Won</creator><creator>Na, Ki Ho</creator><creator>Park, Je Sang</creator><scope>EVB</scope></search><sort><creationdate>20210624</creationdate><title>SUBSTRATE HAVING ELECTRONIC COMPONENT EMBEDDED THEREIN</title><author>Byun, Dae Jung ; Lee, Yong Duk ; Park, Chang Hwa ; Lee, Jin Won ; Na, Ki Ho ; Park, Je Sang</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_US2021193563A13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2021</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>Byun, Dae Jung</creatorcontrib><creatorcontrib>Lee, Yong Duk</creatorcontrib><creatorcontrib>Park, Chang Hwa</creatorcontrib><creatorcontrib>Lee, Jin Won</creatorcontrib><creatorcontrib>Na, Ki Ho</creatorcontrib><creatorcontrib>Park, Je Sang</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>Byun, Dae Jung</au><au>Lee, Yong Duk</au><au>Park, Chang Hwa</au><au>Lee, Jin Won</au><au>Na, Ki Ho</au><au>Park, Je Sang</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>SUBSTRATE HAVING ELECTRONIC COMPONENT EMBEDDED THEREIN</title><date>2021-06-24</date><risdate>2021</risdate><abstract>A substrate having an electronic component embedded therein includes a core structure including a first insulating body and first wiring layers and having a cavity, an electronic component embedded in the cavity, a build-up structure including a second insulating body, covering at least a portion of each of the core structure and the electronic component and filling a portion of the cavity, and second wiring layers, a first passivation layer disposed on a side of the core structure opposing a side of the core structure on which the build-up structure is disposed, and a second passivation layer disposed on a side of the build-up structure opposing a side of the build-up structure on which the core structure is disposed, wherein the first and second passivation layers include different types of materials.</abstract><oa>free_for_read</oa></addata></record>
fulltext fulltext_linktorsrc
identifier
ispartof
issn
language eng
recordid cdi_epo_espacenet_US2021193563A1
source esp@cenet
subjects BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
title SUBSTRATE HAVING ELECTRONIC COMPONENT EMBEDDED THEREIN
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-08T07%3A13%3A08IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=Byun,%20Dae%20Jung&rft.date=2021-06-24&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EUS2021193563A1%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true