DUAL DIELECTRIC LAYER FOR CLOSING SEAM IN AIR GAP STRUCTURE

DUAL DIELECTRIC LAYER FOR CLOSING SEAM IN AIR GAP STRUCTURE

A structure includes an air gap structure including: an opening in a first dielectric layer between adjacent conductors, and a non-conformal dielectric layer over the opening. In some cases, the non-conformal dielectric layer narrows an end portion of the opening of the air gap but may not seal the...

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Hauptverfasser: An, Ju Jin, Gruszecki, Craig R, Van Kleeck, Todd J, McGahay, Vincent J, Lee, Tim H
Format: Patent
Sprache:eng
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BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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creator An, Ju Jin
Gruszecki, Craig R
Van Kleeck, Todd J
McGahay, Vincent J
Lee, Tim H
description A structure includes an air gap structure including: an opening in a first dielectric layer between adjacent conductors, and a non-conformal dielectric layer over the opening. In some cases, the non-conformal dielectric layer narrows an end portion of the opening of the air gap but may not seal the opening. In other cases, the non-conformal layer may seal the end portion of the opening and include a seam therein. The air gap structure may also include a conformal dielectric layer on the non-conformal dielectric layer. The conformal layer either seals the end portion of the opening or, if present, seals the seam. The structure may also include a wiring layer over the air gap structure.
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subjects BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
title DUAL DIELECTRIC LAYER FOR CLOSING SEAM IN AIR GAP STRUCTURE
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