SEMICONDUCTOR CLIP AND RELATED METHODS

SEMICONDUCTOR CLIP AND RELATED METHODS

Implementations of semiconductor clips may include a die attach portion coupled to a step portion, a lead attach portion directly coupled to the step portion, a first alignment feature directly coupled to a first side of the lead attach portion, and a second alignment feature directly coupled to a s...

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Hauptverfasser: TEYSSEYRE, Jerome, XU, ZhengQiao, LEE, Keunhyuk, MALDO, Tiburcio, LIU, Zhiling
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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creator TEYSSEYRE, Jerome
XU, ZhengQiao
LEE, Keunhyuk
MALDO, Tiburcio
LIU, Zhiling
description Implementations of semiconductor clips may include a die attach portion coupled to a step portion, a lead attach portion directly coupled to the step portion, a first alignment feature directly coupled to a first side of the lead attach portion, and a second alignment feature directly coupled to a second side of the lead attach portion. The second side may be opposite the first side. The lead attach portion may be in a plane substantially parallel with a plane formed by the die attach portion.
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subjects BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
title SEMICONDUCTOR CLIP AND RELATED METHODS
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