METHOD OF FORMING MULTIPLE PATTERNED LAYERS ON WAFER AND EXPOSURE APPARATUS THEREOF

An exposure apparatus for transferring a pattern of a reticle onto a wafer is provided. The exposure apparatus includes an illumination module, a reticle stage, a projection module, a wafer stage, and a control unit. The control unit is configured to calculate an alignment setting of the reticle. Th...

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Bibliographische Detailangaben
Hauptverfasser: KWON, BYUNG-IN, YANG, SIWON, LEE, KIHYUNG, JEON, BUM-HWAN, KIM, SOO-HYOUNG
Format: Patent
Sprache:eng
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