CONTACT AND TEST SOCKET DEVICE FOR TESTING SEMICONDUCTOR DEVICE
The present invention relates to a contact and a socket device for testing a semiconductor device. The contact of the present invention is a spring contact which is integrally formed by blanking and bending a metal plate member and includes an elastic portion made of various strips of certain patter...
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creator | Hwang, Dong Weon Hwang, Jae Baek Hwang, Jae Suk |
description | The present invention relates to a contact and a socket device for testing a semiconductor device. The contact of the present invention is a spring contact which is integrally formed by blanking and bending a metal plate member and includes an elastic portion made of various strips of certain pattern and a tip provided at both ends of the elastic portion. Preferably, an inner volume of the contact is filled with a filler having conductivity and elasticity, whereby durability and electrical characteristics are excellent. Further, the test socket according to the present invention is a rubber type employing the above-mentioned contact and has an advantage that it is suitable for testing a fine pitch device. |
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The contact of the present invention is a spring contact which is integrally formed by blanking and bending a metal plate member and includes an elastic portion made of various strips of certain pattern and a tip provided at both ends of the elastic portion. Preferably, an inner volume of the contact is filled with a filler having conductivity and elasticity, whereby durability and electrical characteristics are excellent. Further, the test socket according to the present invention is a rubber type employing the above-mentioned contact and has an advantage that it is suitable for testing a fine pitch device.</description><language>eng</language><subject>MEASURING ; MEASURING ELECTRIC VARIABLES ; MEASURING MAGNETIC VARIABLES ; PHYSICS ; TESTING</subject><creationdate>2021</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20210520&DB=EPODOC&CC=US&NR=2021148950A1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76289</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20210520&DB=EPODOC&CC=US&NR=2021148950A1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>Hwang, Dong Weon</creatorcontrib><creatorcontrib>Hwang, Jae Baek</creatorcontrib><creatorcontrib>Hwang, Jae Suk</creatorcontrib><title>CONTACT AND TEST SOCKET DEVICE FOR TESTING SEMICONDUCTOR DEVICE</title><description>The present invention relates to a contact and a socket device for testing a semiconductor device. The contact of the present invention is a spring contact which is integrally formed by blanking and bending a metal plate member and includes an elastic portion made of various strips of certain pattern and a tip provided at both ends of the elastic portion. Preferably, an inner volume of the contact is filled with a filler having conductivity and elasticity, whereby durability and electrical characteristics are excellent. Further, the test socket according to the present invention is a rubber type employing the above-mentioned contact and has an advantage that it is suitable for testing a fine pitch device.</description><subject>MEASURING</subject><subject>MEASURING ELECTRIC VARIABLES</subject><subject>MEASURING MAGNETIC VARIABLES</subject><subject>PHYSICS</subject><subject>TESTING</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2021</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZLB39vcLcXQOUXD0c1EIcQ0OUQj2d_Z2DVFwcQ3zdHZVcPMPAgt7-rkrBLv6egKVu4Q6hwBFIQp4GFjTEnOKU3mhNDeDsptriLOHbmpBfnxqcUFicmpeakl8aLCRgZGhoYmFpamBo6ExcaoAIZwrRg</recordid><startdate>20210520</startdate><enddate>20210520</enddate><creator>Hwang, Dong Weon</creator><creator>Hwang, Jae Baek</creator><creator>Hwang, Jae Suk</creator><scope>EVB</scope></search><sort><creationdate>20210520</creationdate><title>CONTACT AND TEST SOCKET DEVICE FOR TESTING SEMICONDUCTOR DEVICE</title><author>Hwang, Dong Weon ; Hwang, Jae Baek ; Hwang, Jae Suk</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_US2021148950A13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2021</creationdate><topic>MEASURING</topic><topic>MEASURING ELECTRIC VARIABLES</topic><topic>MEASURING MAGNETIC VARIABLES</topic><topic>PHYSICS</topic><topic>TESTING</topic><toplevel>online_resources</toplevel><creatorcontrib>Hwang, Dong Weon</creatorcontrib><creatorcontrib>Hwang, Jae Baek</creatorcontrib><creatorcontrib>Hwang, Jae Suk</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>Hwang, Dong Weon</au><au>Hwang, Jae Baek</au><au>Hwang, Jae Suk</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>CONTACT AND TEST SOCKET DEVICE FOR TESTING SEMICONDUCTOR DEVICE</title><date>2021-05-20</date><risdate>2021</risdate><abstract>The present invention relates to a contact and a socket device for testing a semiconductor device. The contact of the present invention is a spring contact which is integrally formed by blanking and bending a metal plate member and includes an elastic portion made of various strips of certain pattern and a tip provided at both ends of the elastic portion. Preferably, an inner volume of the contact is filled with a filler having conductivity and elasticity, whereby durability and electrical characteristics are excellent. Further, the test socket according to the present invention is a rubber type employing the above-mentioned contact and has an advantage that it is suitable for testing a fine pitch device.</abstract><oa>free_for_read</oa></addata></record> |
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subjects | MEASURING MEASURING ELECTRIC VARIABLES MEASURING MAGNETIC VARIABLES PHYSICS TESTING |
title | CONTACT AND TEST SOCKET DEVICE FOR TESTING SEMICONDUCTOR DEVICE |
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