ELECTRONIC DEVICE COMPRISING A CARRIER SUBSTRATE AND AN ENCAPSULATING COVER MOUNTED ON THE CARRIER SUBSTRATE, AND CORRESPONDING MOUNTING PROCESS

A carrier substrate is configured to carry at least one electronic chip and includes a mounting front face. An encapsulating cover is mounted on the front face of the carrier substrate through a mounting. This mounting includes at least one seating surface through which the cover and the carrier sub...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: MASTROMAURO, Nicolas, SAXOD, Karine
Format: Patent
Sprache:eng
Schlagworte:
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